Industry Directory: cure temperature (11)

Unifab Electronics

Industry Directory |

High temperature thermal applications,reflow and cure

Master Bond

Industry Directory | Manufacturer

Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds. Master Bond specializes in epoxies, silicones and uv curable polymer systems.

New SMT Equipment: cure temperature (67)

Lead-Free Desktop Reflow Oven with tempereture cure T200N+

Lead-Free Desktop Reflow Oven with tempereture cure T200N+

New Equipment | Reflow

Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Product Description Product Description: T200N+=nitrogen lead free reflow oven T200N+temperature tester  T200N+ is not o

Beijing Torch Co.,Ltd

Low temperature Pick & Place of SMDs on sensitive base material

Low temperature Pick & Place of SMDs on sensitive base material

New Equipment | Pick & Place

ELECTRONIC MANUFACTURING SERVICES (www.sun-tec.ch) ON TEMPERATURE SENSITIVE MATERIALS: SUN-TEC has developed its own cold curing, solvent free contact glues to be able to pick and place SMD systems on heat sensitive substrates. That is why SUN-TEC's

SUN-TEC Swiss United Technologies Co. Ltd.

Electronics Forum: cure temperature (167)

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Thu Feb 22 12:26:33 EST 2001 | traviss

I used a Blue M batch oven quite a bit to cure in works great. All you have to do is get the board up to cure temperature, 150C normally and your all set. It will probably be in there longer than the time required but at that low temperature it shoul

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman

Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy

Used SMT Equipment: cure temperature (7)

Speedline OmniExcel 10 ....under 20k

Speedline OmniExcel 10 ....under 20k

Used SMT Equipment | Soldering - Reflow

Speedline Electrovert Omnimax 10 Oven Manufactured Year: 2012 Voltage: 380, 3 Phase 10 Zones Oven, Top and Bottom Heated Length: 3.855 mm 3 Cooling Zone Cooling Length: 1.293 mm Reflow Operating Temperature: 350 C Curing Operating Tem

smtXtra

Vitronics 2004 Vitronics XPM2 1030

Vitronics 2004 Vitronics XPM2 1030

Used SMT Equipment | Soldering - Reflow

2004 Vitronics XPM2 1030 The Vitronics Soltec XPM2 1030 is a reflow soldering and curing system used in electronics manufacturing. Here are some key specifications and features: Dimensions & Weights: Heating zones: 5 Cooling zones: 2 Total heating

Parker SMT

Industry News: cure temperature (250)

Parts & Supplies: cure temperature (1)

Assembleon ES19204

Assembleon ES19204

Parts & Supplies | Circuit Board Assembly Products

ES19204 Kapton Tape Kapton Tape is a polyimide film-backed silicone adhesive tape with extremely low electrostiatic discharge properties. Antistatic properties is in back adhesive side. It has high dielectric strength. Polyimide masking tape, offers

Shenzhen Eles Technology Co., Ltd

Technical Library: cure temperature (12)

Thermal Curing of Conformal Coatings

Technical Library | 2015-07-27 16:58:29.0

When it comes to the application of conformal coating, curing the coating plays a key role in the circuit assembly and selective conformal coating process. Curing conformal coating occurs after the coating spray/dispense process is complete. The coating is considered “cured” when the conformal coating on the circuit assembly is sufficiently tack-free to be handled. Curing can sometimes be accomplished at room temperature but takes a considerable amount of time to dry. Accelerated conformal coating curing decreases this drying period, the cure process reaches either the tack-free or a fully dried state but not quite having fully cured properties. Accelerated curing techniques include one or a combination of heat, moisture, UV light, and chemical reaction curing. This article focuses primarily on thermal or heat curing.

ETS - Energy Technology Systems, Inc.

Controlling Moisture during Inner layer Processing

Technical Library | 2024-09-02 18:48:58.0

The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.

MacDermid, Inc.

Videos: cure temperature (52)

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries.

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries.

Videos

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php

Heller Industries Inc.

Training Courses: cure temperature (1)

Void Formation in Solder Joints - Causes & Cures - Online Webinar

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ASKbobwillis.com

Events Calendar: cure temperature (4)

Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar

Events Calendar | Tue Apr 07 00:00:00 EDT 2020 - Tue Apr 07 00:00:00 EDT 2020 | ,

Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar

Surface Mount Technology Association (SMTA)

TechDays 2019

Events Calendar | Wed Jun 05 00:00:00 EDT 2019 - Thu Jun 06 00:00:00 EDT 2019 | Neustadt a.d. Donau, Germany

TechDays 2019

Scheugenpflug Inc.

Career Center - Resumes: cure temperature (2)

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

Arturo C Jadear Jr

Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support

6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process

Express Newsletter: cure temperature (277)

Partner Websites: cure temperature (1350)

Asymtek UV6-18 UV Cure Oven - Lewis and Clark

Lewis & Clark | https://www.lewis-clark.com/product/asymtek-uv6-18-uv-cure-oven/

Asymtek UV6-18 UV Cure Oven - Lewis and Clark Skip to content My Cart:  $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH

Lewis & Clark

PCB conformal coating equipment-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,

ASCEN Technology | https://www.ascen.ltd/conformal_coating/611.html

. Apply, cure, and ship immediately and eliminate the time-consuming steps of traditional thermal-cure and room temperature-cure technologies

ASCEN Technology


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Voidless Reflow Soldering

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High Throughput Reflow Oven

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Hot selling SMT spare parts and professional SMT machine solutions

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