Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Industry Directory | Distributor / Manufacturer
Lorlin manufactures discrete semiconductor component test systems for small signal and power devices. 50 years in business, over 3000 installations. SMD devices: transistors, Fets, diodes, scrs, triacs, optos, and many others.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Technical Library | 2017-07-27 16:51:57.0
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.
Operation of PWM-driven motors, such as servo and variable frequency drives (VFD), causes a number of problems in equipment, including damage to the motor’s bearings from leakage currents via electrical discharge machining (EDM) and to motor’s insula
Used SMT Equipment | In-Circuit Testers
luke 9500B-3200 3200 MHz High Performance Oscilloscope Calibration Workstation Oscilloscope calibration can be complex, time consuming and expensive. A significant amount of skilled operator interaction and interpretation is often required to c
Used SMT Equipment | In-Circuit Testers
Keithley 2410 Model 2410 High-Voltage SourceMeter w/ Measurements up to 1100V and 1A, 20W Power Output Key Features and Benefits: New class of instruments designed for high speed DC testing Family of products offers wi
New Equipment | Test Equipment
Key Features and Specifications Measurement of Real, Imaginary and Total Current Ground Fault Interruption (GFI) for operator safety Programmable Ramp, Test and Fall Times Storage of Tests Setups, 25 User (5 predefined), and 9 Mu
Technical Library | 2017-03-02 18:13:05.0
The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology. This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed.
Used SMT Equipment | In-Circuit Testers
Exfo CableSHARK P3 VF/DSL Cable Qualifier EXFO CableSHARK P3 - POTS / DSL Tester The CableSHARK P3 includes the necessary VF and broadband measurements for qualifying and troubleshooting a local loop such as loop holding/dialling, frequency r
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