Industry News | 2015-11-12 20:58:32.0
MIRTEC and YXLON jointly received a 2015 Global Technology Award in the category of Software – Production for the new SmartLoop yield improvement system. The award was presented to the companies during a ceremony on Tuesday, Nov. 10, 2015 that took place at the Messe München exhibition center in Munich, Germany during Productronica.
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2013-01-21 11:15:30.0
MIRTEC, announces the opening of a new manufacturing facility in Europe to further strengthen business and local support.
Industry News | 2016-04-20 17:45:19.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that it now sells direct to customers in the UK.
Industry News | 2014-04-29 19:21:57.0
MIRTEC announces that it has appointed ALFA TEST SRL as its newest manufacturers’ representative.
Industry News | 2007-01-29 15:10:05.0
Palo Alto, Calif.
Industry News | 2011-12-14 16:19:46.0
MIRTEC announces that ACD purchased two Mv-7xi In-Line AOI Systems during the recent Productronica Trade Fair in Germany. ACD has very high inspection standards and the new MV-7xi AOI systems will help the company continue to meet or exceed those requirements.
Industry News | 2013-10-02 14:39:35.0
Baja Bid announced its latest event which features quality used equipment at discounted prices for the electronics manufacturing industry.
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
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The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
