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Aeroflex 3920

Aeroflex 3920

Used SMT Equipment | In-Circuit Testers

Aeroflex IFR 3920 Digital Radio Test Set The 3920 is the latest in next generation portable test for advanced professional analog and digital radio communications. Aeroflex has an exclusive new option for the Aeroflex 3900 Series Digital Radi

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CyberOptics to Demonstrate Yield-Improving WaferSense® & ReticleSense® Technology at SEMICON West

Industry News | 2017-06-07 12:11:56.0

CyberOptics® Corporation will demonstrate the WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) at SEMICON West July 11-13 at the Moscone Center in San Francisco, California in booth #6562.

CyberOptics Corporation

CyberOptics Unveils WaferSense® Auto Resistance Sensor™ (ARS) at SEMICON Korea

Industry News | 2020-01-16 16:26:16.0

CyberOptics® Corporation will exhibit at SEMICON Korea from February 5-7th, 2020 at the COEX in Seoul, booth #C236. During the show, the company will unveil and demonstrate its new WaferSense® Auto Resistance Sensor™ (ARS) with CyberSpectrum™ software for semiconductor tool set-up and diagnostics.

CyberOptics Corporation

CyberOptics Demonstrates Yield-Improving Wireless Measurement Devices for Semiconductor Tools at SPIE

Industry News | 2018-02-19 13:38:21.0

CyberOptics® Corporation announces it will demonstrate its ReticleSense® Auto Multi Sensors – the world’s most efficient and effective wireless measurement devices for semiconductor fabs and equipment OEMs at SPIE Advanced Lithography at the San Jose Convention Center, February 27-28th at booth #314.

CyberOptics Corporation

CyberOptics Demonstrates High-Precision Sensor Technologyat Touch Taiwan

Industry News | 2021-04-08 04:59:48.0

CyberOptics® Corporation (NASDAQ: CYBE) will showcase the In-Line Particle Sensor™ (IPS), WaferSense® wireless measurement sensors and the NanoResolution Multi-Reflection Suppression™ (MRS™) sensor for inspection and metrology at the Touch Taiwan Exhibition on April 21-23rdat the Taipei Nangang Exhibition Center in Taiwan in booth M330.

CyberOptics Corporation

CyberOptics to Launch New AVLS3 with CyberSpectrum™ Software and New NanoResolution MRS Sensor at SEMICON West

Industry News | 2019-06-11 10:45:14.0

CyberOptics® Corporation will exhibit at SEMICON West, July 9-11, 2019 in booth #5769 at the Moscone Center in San Francisco, CA. During the show, the company will launch its new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3) with CyberSpectrum software. Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense AVLS3 – The most efficient and effective wireless measurement device for leveling and vibration.

CyberOptics Corporation

CyberOptics to Demonstrate AVLS3 and NanoResolution MRS Sensors at SEMICON Taiwan

Industry News | 2019-08-21 16:01:18.0

CyberOptics® Corporation will exhibit at SEMICON Taiwan in booth # L0310. During the show, the company will launch its new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3) with CyberSpectrum software and the new NanoResolution Multi-Reflection Suppression (MRS) sensor for inspection and metrology in semiconductor applications.

CyberOptics Corporation

CyberOptics to Showcase Metrology and Inspection Solutions at SEMICON China

Industry News | 2021-03-12 04:57:42.0

CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with Multi-Reflection Suppression™ (MRS™) sensor technologyat SEMICON China,scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre, hall N1, booth 1387 and 1325. The company also will demonstrate high-precision WaferSense® sensors for semiconductor tool setup and diagnostics.

CyberOptics Corporation

CyberOptics to Present '100% Wafer Bump Metrology and Inspection' Technical Paper at the SEMICON Taiwan SiP Global Summit 2020

Industry News | 2020-09-06 04:37:56.0

CyberOptics® Corporation (NASDAQ: CYBE) will present at the SEMICON Taiwan Global SiP Summit on September 24, 2020 at 4:20pm. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation 'Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration'.

CyberOptics Corporation


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