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New Low-Temperature Solder Paste from SHENMAO

Industry News | 2018-06-17 16:55:59.0

SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Shenmao Technology Inc.

Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC

Industry News | 2015-08-23 14:25:07.0

Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.

Engineered Conductive Materials, LLC

Juki Original JUKI 750 ZT CONTROL CARD E86017250A0

Juki Original JUKI 750 ZT CONTROL CARD E86017250A0

Parts & Supplies | Pick and Place/Feeders

Hot sell JUKI 750 ZT CONTROL CARD E86017250A0 Original used in good condition,full test before ship. Supply all juki spare parts at low price JUKI 40056579 WIND ROLL SPRING www.fujintai.com JUKI 40056735 OP CAMERA ASSY FUJINTAI TECHNOLOGY CO.,

FUJINTAI Technology Co.,Ltd

High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO

Industry News | 2022-10-11 17:22:18.0

SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.

Shenmao Technology Inc.

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

China Becomes the Hot Spot for Global Electronics Manufacturing Giants

Industry News | 2012-03-24 10:06:28.0

NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia

Nepcon Electronics

Professional Solutions for Hot Air SMD Rework

Industry News | 2011-08-24 21:38:06.0

From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.

Finetech

Techcon Systems to Show New Hot Melt Jet Valve at NEPCON South China

Industry News | 2016-08-24 20:25:35.0

Techcon Systems will exhibit in Booth # 1H55 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Company representatives will showcase the new TS9300HM Hot Melt Jet Valve as well as Techcon Systems’ lineup of industry-leading valves.

Techcon Systems

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

7 Ways to Save Energy on Your Air Compressor

Industry News | 2021-12-13 20:10:54.0

As one of the power sources of manufacturing and production enterprises, compressed air requires continuous operation of equipment to ensure the stability of air supply pressure, which is also the basic condition of production and operation of enterprises. The air compressor unit, the main manufacturing equipment, is the core machine to undertake this task, and its continuous and reliable run ensures its own stable operation. Since it is a piece of running equipment, it needs a power supply to operate, large power consumption is the core of cost increase.

OKmarts Industrial Parts Mall


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