Electronics Forum | Mon Aug 18 17:15:15 EDT 2008 | jlawson
This can be seen on leaded soldering also as well as LF (worse with LF). To reduce this you can look at your stencil and profile. Printing a cross-hatch deposit can reduce the voiding as it allow gasses to release when in reflow - thats the theory
Electronics Forum | Sun Apr 19 12:54:39 EDT 2020 | davef
A-620G doesn't require 100% wetting to the thermal pad. It requires 100% wetting to the land in the end-joint area. The end joint is the portion of the solder connection that is at the top [or bottom] of the connection. Look at 7.1.3 Solder Joint A
Electronics Forum | Mon Sep 20 14:06:02 EDT 1999 | Claude Couture
| Can anyone help with programming a D^2 Pak on a Panasert MV100. I'm having trouble setting up the parts data and teach the component. What should the Up, Down, Left, Right, Component Code, Lead Details, and Cut Lead Settings be? | A link to the pac
Electronics Forum | Wed Sep 22 21:07:00 EDT 1999 | JAX
| Can anyone help with programming a D^2 Pak on a Panasert MV100. I'm having trouble setting up the parts data and teach the component. What should the Up, Down, Left, Right, Component Code, Lead Details, and Cut Lead Settings be? | A link to the pac
Electronics Forum | Wed Jun 09 12:20:26 EDT 1999 | Gang Pan
I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. There is anybody has experience on metal-based PCB reflow process? I guess pre
Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Fri Jun 01 13:10:23 EDT 2001 | caldon
Be current.......Is my best suggestion. Electronics Theory and three stage audio amplifiers are great for class room environment but does not 100% apply in manufacturing. Teach through hole and SMT related classes. teach manufacturing. There are tons
Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
Electronics Forum | Tue Apr 06 09:50:58 EDT 1999 | Justin Medernach
| Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | I use a double sided reflow process all day, everyday. I've hung QFP240s with embedded heat sinks and they don't fall off. Yei
