Electronics Forum | Fri Dec 03 13:29:39 EST 2004 | cyber_wolf
Voids are quite common. You just need to make sure that it is not excessive per your assembly criteria. Take a look at a D-pak under X-ray.
Electronics Forum | Fri Apr 17 22:30:19 EDT 2020 | smith88
IPC calls out 100% wetting to land. I need to understand why this is needed and what functionality I will lose if I have joints at 80%
Electronics Forum | Thu Dec 21 10:27:24 EST 2006 | realchunks
>>> Now you must take into account your total board mass as well. If you have tons of heat sinks, or parts on the other side that can affect your profile, you should have them on the board when profiling. That�s where the "engineering" part in all
Electronics Forum | Sat Dec 04 09:42:18 EST 1999 | Chris McDonald
Just as explained in a follow-up you are getting too much paste on the pad. The pad is probably the right size but you cant have your aperature the same size as your pad. What we have done is put a Cross in the stencil. This will reduce the paste and
Electronics Forum | Tue Aug 25 14:34:24 EDT 1998 | D Wanzek
I am looking for advice on feeders for the MPAV Panasonic machine. We are about to encounter our first experience with Panasonic. We are unsure of which style feeders to buy for tube parts. Parts mix includes all sizes of D-paks, SOICs, PLCCs and so
Electronics Forum | Thu Jan 15 15:16:56 EST 2009 | jsherrow
We recently had our customer report a component failure trend of a few percent. Analysis indicates wire bond failure internal to a d-pak caused by what appears to be chlorine contamination. We're running a lead free process with aqueous wash. 700 co
Electronics Forum | Wed Aug 26 07:00:16 EDT 1998 | Wayne Bracy
| I am looking for advice on feeders for the MPAV Panasonic machine. We are about to encounter our first experience with Panasonic. We are unsure of which style feeders to buy for tube parts. Parts mix includes all sizes of D-paks, SOICs, PLCCs and
Electronics Forum | Mon Jul 22 09:02:25 EDT 2002 | xrayhipp
Rob is right on it. The best is when Manufacturing has developed a solid process for a particular build using set component packaging; then, when that build hits the floor later that year for a second run etc.. all odd-forms are in different package
Electronics Forum | Fri Jan 28 09:30:07 EST 2005 | reash
Well the powers that be actually want to go with a regular rework station, for future growth. I guess they plan on using BGAs sometime in the near future. We're also planning on using a D-Pak device in this first board. So now we're looking at the
Electronics Forum | Mon Aug 18 17:15:15 EDT 2008 | jlawson
This can be seen on leaded soldering also as well as LF (worse with LF). To reduce this you can look at your stencil and profile. Printing a cross-hatch deposit can reduce the voiding as it allow gasses to release when in reflow - thats the theory
