Radian designs and manufactures heatsink and fansink products for high end electronics, including CPUs, DC converters, BGAs, IGBTs and TECs. We also provide thermal analysis, rapid prototyping and design assistance.
Industry Directory | Manufacturer
Radian designs and manufactures heatsink and fansink products for high end electronics, including CPUs, DC converters, BGAs, IGBTs and TECs. We also provide free thermal analysis, rapid prototyping and heatsink design assistance.
Commercial-off-the-shelf (COTS) PC/104 and PC/104-Plus computer cards and components, including x86 and PowerPC CPUs; DC/DC converter power supplies and interfaces; fan cards and heatsinks; digital I/O and mass storage boards; fieldbus interfaces (C
Ring lug NTC thermistor surface temperature probes are designed for screw-in-place mounting. Most of these temperature probe housings are standard ring terminals or ring lugs with the thermistor potted in the barrel of the lug, popular for temperatur
Electronics Forum | Thu Dec 19 20:40:08 EST 2002 | jonfox
One common practice, depending on what is on the other side of the PCB and how much heat you need to draw away from the part, is to manufacture a pseudo-heatsink into the board itself. It looks like a large tinned pad but has a dense array of vias f
Electronics Forum | Thu Dec 19 20:45:47 EST 2002 | jonfox
One common practice, depending on what is on the other side of the PCB and how much heat you need to draw away from the part, is to manufacture a pseudo-heatsink into the board itself. It looks like a large tinned pad but has a dense array of vias f
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2019-03-03 18:51:58.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor this Chapter Tutorial Program on March 28 featuring presentations by Yaad Eliya and Jim Barry of PCB Technologies.
Technical Library | 2024-07-24 01:27:58.0
A study of the Thermo Design PCB Indicates The better the performance of the heatsink (=low Rth), the more influence the TIMs have The thickness of a TIM is often more critical than the thermal conductivity of the material The thermal resistance of the surface between the materials are most critical Better use many small vias than a few big vias! Plated or filled vias are very expensive to get, better try to stay with standard!
Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Whizz Systems | https://www.whizzsystems.com/wp-content/uploads/2021/09/5G-design-reference-platform.pdf
5G Reference Design Platform 5G -NR Open-Radio Unit (O-RU) Reference Design Platform Get your radio design up and running quickly with reference design enablement The Radio Access Network (RAN
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined
