Electronics Forum | Mon Mar 24 12:11:38 EDT 2008 | scombs
Is this what you are looking for? We do this on quite a few boards and it has eliminated component problems from the Cab depaneler (pizza cutter)
Electronics Forum | Thu Mar 20 23:01:40 EDT 2008 | davef
Boardhouse: Not to be confruntational, just trying to better understand what you're telling us. When you say, "Standard spacing most board houses would like to see is" blablabla. * What are the units of these dimensions? * You'd like to see these dim
Electronics Forum | Tue Apr 01 19:45:07 EDT 2008 | boardhouse
Dave, Sorry for the slow response, have been out of town, The spacing I was referring to was from board edge to copper features. This spacing is required to keep the router and score blades from exposing or hitting the Copper. Regarding the slot I
Electronics Forum | Wed Apr 09 14:50:03 EDT 2008 | bradlanger
We use a FKN pizza cutter and found that even with 5mm clearance and the proper orientation of the part larger ceramic capacitors 1812, 1210 would still stress fracture. We have successfully fixed stress fracture problems by adding routed relief slot
Electronics Forum | Thu Mar 20 17:39:41 EDT 2008 | boardhouse
FSW, Another suggestions is if you have rail on your product and you are concerned about stress fracturing certain components you could add a routed slot to add relief in that area. So when you snap the rail off their would be no stress in that area
Electronics Forum | Tue Mar 25 14:05:16 EDT 2008 | flipit
X7R >Z5U,Y5V. Y5Vs crack more than NPOs. Ceramic resonators crack often as well. I found that the chop style like the Fancord VPD5 is the lease stressful of the V-Score cutters. We have run as close as 0.025" to the edges with 0805s with no crack
Electronics Forum | Wed Mar 26 16:12:46 EDT 2008 | jlawson
If you have jobs where you can not, there is a company in Japan that makes the best v-groove depanelers called TST, 'guru's in v-groove depanelising'. Their systems can be supplied to reduce stress on cutting to near zero compared to CAB and other lo
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Thu Jan 12 13:21:11 EST 2006 | barryg
Opinions. I have a large finned heatsink that we place over a D2pak transistor. This heatsink is designed to heatsink the transistor through the junction of the pad area that the transistor is attached to. The paste pattern we chose was small dots ar
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
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