Electronics Forum | Wed Mar 09 19:51:28 EST 2005 | KT
Greetings: I would like to know the common land patterns and aperture shapes that are currently in use. We are doing some research on the same. Please respond to the thread if you have a success story with you current design. Thanks KT
Electronics Forum | Fri Apr 06 09:36:46 EDT 2007 | pjc
FYI: IPC-SM-782 has been superseded by IPC-7351A, IPC-SM-782 land patterns previously found under the "Manufacturer Part Number" database portion of SM-782 Land Pattern Calculator are no longer maintained by IPC.
Electronics Forum | Mon Dec 09 16:10:50 EST 2013 | davef
IPC-7351 Land Pattern Calculator and Tools [landpatterns.ipc.org/] Generic requirements for surface sount Design and Land Pattern Standards, is supplemented by a footprint expert software tool
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau
hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:
Electronics Forum | Tue Nov 30 15:38:27 EST 1999 | Wendy Casker
Hi, I am looking for land patterns for 0612 and 0508 chip capacitors. Because they are not standard (yet) package sizes, i am having trouble finding a standard land pattern. (If you don't know what these are, picture a 1206 or an 0805 with the te
Electronics Forum | Tue Jul 05 13:54:35 EDT 2005 | Sandeep
We are facing lot of problems with tombstoning in 0201 components. Ironically tomstoning in these components is not occuring while reflow but it is happening when we subject them to thermal cycling test. We have been investigating the cause and thoug
Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Electronics Forum | Fri Apr 27 11:26:53 EDT 2001 | pteerink
Check out IPC SM-785 Land pattern guidelines for SMT www.ipc.org Phil
Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
