Full Site - : damaged corner of pcb (Page 7 of 11)

piercing of test vias at ICT

Electronics Forum | Thu Nov 14 05:45:51 EST 2002 | Jon O'Connell

Has anyone had experiences of ICT test fixtures actually damaging the PCB boards - typically when they have moved away from HASL finish to OSP. I would also like to hear more about any specific issues seen at ICT for non HASL pcb finishes thanks -

Re: Repair of SMT boards...a question!!

Electronics Forum | Mon Jun 07 10:52:04 EDT 1999 | Brian Wycoff

| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |

Know of anyone using Screen Printer (opposed to Stencil Printer) in SMTA?

Electronics Forum | Sat Apr 15 00:10:52 EDT 2023 | sarason

Having worked in a hybrid maanufacturing operation many years ago, yes stencils are great and have the required accuracy, but on the down side there were 2 operators that were absolute wizzes at turning them out and that could mean up to 20 stencil

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto

We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top

Does pot temperature affects quality of the solder joints?

Electronics Forum | Mon Feb 06 22:38:46 EST 2017 | david_chiu

No matter in selective soldering or wave soldering process, higher pot temperature and longer wetting time can increase IMC thickness and joint strength(reliability), but as Daivf said, you need to care if the DIP component and bare PCB was damaged b

Questions About Risk of PCB Delamination as a Result of Moisture Build Up After Damage to Solder Mask

Electronics Forum | Mon Apr 29 22:25:30 EDT 2019 | pcbindex1

Besides, regulated power supply should be installed separately on the printing boards. When power and circuits share the same printing boards, it should be avoided that regulated power supply and circuit components are mixed or power and circuits sha

Disadvantages of using the ultrasonic cleaners - PCB cleaning

Electronics Forum | Fri Aug 22 13:10:51 EDT 2008 | bschreiber

The folowing articles are available at: http://www.smartsonic.com/article.html "Why Not Ultrasonic Cleaning?" by William Kenyon "Damage-Free Ultrasonically-Assisted Cleaning of Printed Circuit Assemblies" - by B.P. Richards et al "Does Ultrason

Questions About Risk of PCB Delamination as a Result of Moisture Build Up After Damage to Solder Mask

Electronics Forum | Tue Apr 23 17:18:54 EDT 2019 | laserpro

Hi Dave, Thanks a lot for your reply. After doing some process work on a Laser Etching machine it was brought to my attention by a colleague that if the solder mask was being penetrated fully, we could be at risk for absorption of moisture leading

Questions About Risk of PCB Delamination as a Result of Moisture Build Up After Damage to Solder Mask

Electronics Forum | Tue Apr 23 10:31:59 EDT 2019 | laserpro

Hi all and thanks for viewing my post! My questions related to the subject line are as follows: 1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask? 2. Does exposed FR4 na

Which side of PCB should be prefered for screening...

Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake

Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas


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