Full Site - : damp heat test (Page 11 of 115)

Anritsu S400A

Anritsu S400A

Used SMT Equipment | General Purpose Test & Measurement

S400A Site Master Broadband one-port transmission line and antenna analyzer Covering the broadcasting, paging, PMR, SMR, AMPS/DAMPS, GSM 900/1800, PCS 1900, ISM, and WLL frequency bands, the S400A is a handheld instrument designed to address the 3.7

Test Equipment Connection

Juki cable

Juki cable

Parts & Supplies | Tape and Reel

type:34pin、64pin.... length:1.2m、1.5m、 Main material: copper wire Heat resistance: 105 ℃ Suitable for: ICT(TRI、Jet、PTI), automation equipment, circuit board testing machine

Shenzhen PTI Technology CO.,LTD

Birk Manufacturing,Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Birk Manufacturing develops innovative thermal heating solutions, such as heaters, RAPT°R heated tubes, and temperature sensors. Birk’s flexible heaters can be easily integrated into assemblies including heat sinks, sensors.

Cypress Industries

Industry Directory |

Manufacturer Connectors Custom Molded Copper Cables Custom Plastics Fiber optic Cables Power Supplies Fans & Heat Sinks PDA USB Test Fixtures Fiber Optic Training

ADVANCED BORON NITRIDE EPOXY FORMULATIONS EXCEL IN THERMAL MANAGEMENT APPLICATIONS

Technical Library | 2020-10-14 14:33:36.0

Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.

Epoxy Technology, Inc.

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Industry News | 2012-08-10 07:00:10.0

Engineered Conductive Materials introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules.

Engineered Materials Systems, Inc.

Engineered Conductive Materials Introduces Low-Cost, Flexible Conductive Adhesive CA-141

Industry News | 2012-12-04 15:55:26.0

Engineered Conductive Materialsintroduces the fast curing CA-141 Conductive Adhesive for stringing and bussing next-generation CIGS solar modules.

Engineered Conductive Materials, LLC

MPI Thermal

Industry Directory | Consultant / Service Provider

The ThermalAir temperature products are a series of high capacity thermal air stream systems that are used for temperature testing, fast thermal cycling and device temperature characterization of comp

TotalTemp Technologies, Inc.

Industry Directory | Manufacturer / Other

TTi makes standard and custom thermal platforms, Hybrid Benchtop Temperature Chambers which combine the benefits of a small benchtop chamber with a separately controlled thermal platform for speed, uniformity versatility.

Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement

Industry News | 2014-05-07 16:25:39.0

Formula E s.r.l., a leading supplier of photovoltaic technology and automated manufacturing lines, and Engineered Materials Systems have entered into an agreement for the development of electrically conductive adhesives for use on Formula E automated manufacturing lines.

Engineered Materials Systems, Inc.


damp heat test searches for Companies, Equipment, Machines, Suppliers & Information