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Noise Fault Detection of High Low Temperature Test Chamber(Climatic chamber)

Technical Library | 2019-04-11 06:04:49.0

With the development of science and technology, the climatic chamber quality has been improved, and the failure rate is reduced, but there still have the failure probability.today we introduce what are the mian factors for big noise high low temperature test chamber: 1.External factors: the bottom angle is uneven, the ground is uneven, adjust the bottom angle, ensure the equipment is in a horizontal position; 2.The equipment is touched other objects or pushed against the wall,pls remove the objects and keep a certain distance from the wall. 3.Compressor noise:check whether the compressor collides with the pipeline,and evaporator dish is loose or not. 4.Check whether compressor shock absorbers are aging and replace them. 5.Solenoid valve noise: solenoid valve reversing caue loud sound, pls add damping glue, if no effect, need to replace solenoid valve. If there is AC noise, need to replace the power board. 6.Check wether the fan or the fan string shaft make noise,whether the fan blades are touched and deformed, whether the fan is fixed or not, pls adjust accordingly or add the rubber pad. If further technical questions,contact us without hesitation!---Climtest Symor® technical team

Symor Instrument Equipment Co.,Ltd

A Case Study on Evaluating Manual and Automated Heat Sink Assembly Using FEA and Testing

Technical Library | 2016-06-23 13:24:56.0

Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.

Flex (Flextronics International)

R&D Technical Services, Inc.

Industry Directory | Manufacturer

R&D Technical Services was formed in 1996 to support the Vapor Reflow market and is currently the leading source of Vapor Phase equipment.

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Industry News | 2012-08-10 07:00:10.0

Engineered Conductive Materials introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules.

Engineered Materials Systems, Inc.

Engineered Conductive Materials Introduces Low-Cost, Flexible Conductive Adhesive CA-141

Industry News | 2012-12-04 15:55:26.0

Engineered Conductive Materialsintroduces the fast curing CA-141 Conductive Adhesive for stringing and bussing next-generation CIGS solar modules.

Engineered Conductive Materials, LLC

TTC100C - Lead Free Tip Tinner

TTC100C - Lead Free Tip Tinner

New Equipment | Solder Materials

Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic

FCT ASSEMBLY, INC.

Tutco Farnam Custom Products

Industry Directory | Manufacturer

Manufacturer of custom air heaters, open coil heating elements, process heaters, flexible silicone rubber heaters. Applications include, dehumidification, resin drying, ecu, rework station, food warming, printing, load banks.

Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement

Industry News | 2014-05-07 16:25:39.0

Formula E s.r.l., a leading supplier of photovoltaic technology and automated manufacturing lines, and Engineered Materials Systems have entered into an agreement for the development of electrically conductive adhesives for use on Formula E automated manufacturing lines.

Engineered Materials Systems, Inc.

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

Technical Library | 2009-07-22 18:33:41.0

This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV.

i3 Electronics

Datum Alloys Ltd

Industry Directory |

Datum Alloys is an international supplier of speciality metals and special purpose alloys,


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