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Data I/O Corporation’s FLXHD Duplication System Selected by the Innovation Awards for the Rapidly Growing e-MMC Device Market FLXHD is the only automated e-MMC duplication system in a desktop footpri

Industry News | 2012-04-27 09:01:49.0

Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, today announced that it has been awarded a 2012 EM Asia Innovation Award in the category of Programming Systems for its FLXHD e-MMC Duplication System.

Data I/O Corporation

Data I/O Announces Appointment of Dr. Cheemin Bo-Linn to Board of Directors

Industry News | 2022-01-10 16:53:52.0

Data I/O Corporation (NASDAQ: DAIO) announced that Dr. Cheemin Bo-Linn will be joining the Board of Directors of Data I/O. Dr. Cheemin Bo-Linn is the CEO of Peritus Partners, a valuation accelerator, for industry sectors including automotive, electronics, consumer, and medical sectors with integrated security.

Data I/O Corporation

JEDEC Publishes Breakthrough Standard for Wide I/O Mobile DRAM

Industry News | 2012-01-07 22:06:29.0

JEDEC Solid State Technology Association announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry, Wide I/O mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices.

JEDEC Solid State Technology Association

JEDEC Publishes Breakthrough Standard for Wide I/O Mobile DRAM

Industry News | 2012-01-13 13:24:14.0

JEDEC announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry, Wide I/O mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices.

JEDEC Solid State Technology Association

Data I/O and Matthew Associates to Feature Industry Leading FlashPAK III and ProLine RoadRunner at SMTA Nutmeg Expo & Tech Forum

Industry News | 2010-11-15 22:12:10.0

Data I/O Corporation and Matthew Associates will showcase the FlashPak III and ProLINE-RoadRunner™ systems at the upcoming SMTA Nutmeg Expo & Tech Forum

Data I/O Corporation

Data I/O Corporation’s ProLINE-RoadRunner™ Now Supports Panasonic NPM SMT Placement Machines

Industry News | 2011-02-02 11:44:55.0

Data I/O Corporation announced support for Panasonic NPM Surface Mount Placement Machines with the ProLINE-RoadRunner™. Customers with a Panasonic NPM model SMT machine can now plug the ProLINE-RoadRunner directly into the SMT placement machine and program memory devices just before placement on the circuit board.

Data I/O Corporation

Data I/O’s FlashCORE III Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:15:12.0

REDMOND, Wash. – November 2009 – Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, announces that it has been awarded a Global Technology Award in the category of Programming for its FlashCORE III. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

Data I/O Corporation

Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package

Technical Library | 2018-01-17 22:47:02.0

Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016

STATS ChipPAC Inc

Data I/O Wins Award for LumenXTM Programming Technology at NEPCON Shanghai

Industry News | 2016-04-30 12:18:21.0

Data I/O Corporation announces that it received a 2016 SMT China Vision Award in the category of Programming for the new LumenXTM programming technology. The award was presented to the company on April 26, 2016 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

Data I/O Corporation

Data I/O to Demonstrate Two-Time Award-Winning PSV7000 Automated Programming System at NEPCON Shanghai China

Industry News | 2014-04-16 12:49:15.0

The world’s premier automated programming system with the speed, flexibility, small parts handling and fast changeover to handle any job at the lowest total cost of ownership

Data I/O Corporation


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