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ADLINK Technology, Inc.

Industry Directory | Manufacturer

Provider of wide range of embedded computing products and services to the test & measurement and automation industries.

ASSY TECHNOLOGY CO.,LTD.

Industry Directory | Manufacturer

With over many years of PCB assembly experience, we can produce high-density PCBA such as a main-controlled board for electronics equipment, I/O Board for Robots, and PCBA for Smart Homes. ODM or OEM business are available.

Boundary Scan PXI Modules

Boundary Scan PXI Modules

New Equipment | Other

In the recent years, PXI has established its position in the test and measurement industry, especially with such features as high data transfer rates, small rugged industrial footprint, open standard and multiple vendors. PXI (PCI eXtensions for Inst

GOEPEL Electronic

Data I/O Announces New Distribution Partnership with Le Champ in SE Asia

Industry News | 2009-05-04 16:19:40.0

REDMOND, Wash. � May 4, 2009 � Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, announces that the company recently completed a distribution agreement with Le Champ Pte Ltd.

Data I/O Corporation

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

Technical Library | 2013-03-14 17:19:28.0

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.

Jet Propulsion Laboratory

Data I/O Announces Anthony Ambrose as President, Chief Executive Officer and Director

Industry News | 2012-10-26 11:31:20.0

: Data I/O Corporation (NASDAQ:DAIO), announces the election of Anthony Ambrose as President effective today, and as Chief Executive Officer effective November 14, 2012.

Data I/O Corporation

Data I/O Wins 35th Industry Award

Industry News | 2020-08-28 03:03:47.0

Data I/O Corporation (NASDAQ: DAIO) announces that it was awarded a 2020 SMT China Vision Award in the category of Device Programming for its PSV2800. The award was presented to the company during an Aug. 26, 2020 ceremony that took place during NEPCON Asia in Shenzhen.

Data I/O Corporation

Data I/O Earns ISO 9001:2015 Certifications

Industry News | 2018-02-01 20:03:31.0

Data I/O Corporation (NASDAQ: DAIO), a leading global provider of advanced data programming and security provisioning solutions for flash-memory, flash based microcontrollers, secure elements and authentication ICs announced the company’s Quality Management System (QMS) received certification to the International Organization for Standardization (ISO) 9001:2015 standard. Data I/O’s QMS system governs processes for product design, development and manufacture.

Data I/O Corporation

Achieve the highest quality standards and production yield for programming MLC NAND devices

Industry News | 2013-08-06 14:51:14.0

Data I/O Corporation (NASDAQ: DAIO) today announced Anthony Ambrose, President and CEO, will present at the upcoming Flash Memory Summit on best practices for programming Multi Level Cell (MLC) NAND memory devices.

Data I/O Corporation

Data I/O Expands Sales Representation with Assembly Products LLC

Industry News | 2019-07-18 09:03:36.0

Data I/O Corporation announced that the Company has completed a sales representative agreement with Assembly Products LLC to expand sales representation in the New England region in the US.

Data I/O Corporation


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