Electronics Forum | Tue Jun 28 10:51:32 EDT 2005 | mattkehoe
Thanks for the replies, - solder paste used ? NC ? other ? Water soluble 63/37 paste - reflow in Air or N2 ? Infrared - temp ramp up before soack (�C/second) ? Will have to check. This profile has been used on numerous gold plated boards in our
Electronics Forum | Tue Aug 30 09:18:40 EDT 2005 | PWH
Agreed - D.I. a must. Also, operators will have to pay attention to lesser stencil life than no-clean paste. Product specs. might say the stencil life is similar but experience has showed us that no-clean last much longer and rolls for a longer tim
Electronics Forum | Tue Feb 17 09:37:16 EST 2015 | charliedci
We made the same change a year ago, from foam to spray fluxer. One of the reasons we changed, to keep the acid number within specs (foam fluxing) we had to measure once or twice a day and add DI water to make up for evaporation, all along not able to
Electronics Forum | Fri Nov 05 18:36:11 EST 1999 | John
I think I'll have to get a copy of those specs. This vendor claims that the 40 uG/sq in is IPC class III and is very, very, clean. I would like to show him (or at least upper management)that what he's says just isn't so. Unfortunately, I don't think
Electronics Forum | Wed Apr 14 13:37:56 EDT 1999 | Mark Charlton
Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? I consider "fines" individual unmelted metal spheres that are found in solder
Electronics Forum | Wed Apr 08 18:15:18 EDT 1998 | Graham Naisbitt
Scott, I am not really in a position to answer this as fully as I would like because most military work with which I am familiar is subject to some degree of secrecy most especially on the internet. At least we have signed up to such restrictions. Ho
Electronics Forum | Tue Feb 01 14:03:16 EST 2000 | Bill Schreiber
When cleaning water washable flux from PCBs using U/S, the final rinse can be with spray DI water for aesthetic purposes because the wash cycle is really just a long U/S rinse (no added chemistry). Fresh DI water should be continuously added to fresh
Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Tue Nov 28 13:21:33 EST 2000 | Graham Naisbitt
Terry The SCC3 product is a vinyl modified silicone. It is less able to perform at low temps as it becomes brittle. It is not easy to repair because it is essentially silicone. It is not a qualified material to the MIL-I-46058 Spec. Are you sure yo
Electronics Forum | Tue Jun 19 17:33:09 EDT 2001 | genny
We don't actually leave the residue on the board, even though the Kester spec sheet says it is ok not to clean - we do spot hand cleaning with Safety Wash. Kester also said that there shouldn't be any problem with mixing RA with no-clean, although w
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