Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas
We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe
Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob
Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as
Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
Electronics Forum | Tue Oct 25 15:19:15 EDT 2005 | jimmyjames
Sorry this is such a long thread but I would like as much input as possible to everything I ramble on about... :) ------------------------------------------------------ We are now seeing more and more RoHS parts showing up in our SMT inventory and
Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS
3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or
Electronics Forum | Fri Jun 22 13:47:51 EDT 2007 | 18424
Good afternoon all, I am looking for help from you folks to find a place that can do metalurgical analysis on components and contamination. We are an OEM and just recently received back from the customer several units that failed in the field after
Electronics Forum | Fri Jun 22 13:49:46 EDT 2007 | 18424
Good afternoon all, I am looking for help from you folks to find a place that can do metalurgical analysis on components and contamination. We are an OEM and just recently received back from the customer several units that failed in the field after
Electronics Forum | Wed Jun 18 13:08:52 EDT 2008 | sleech
Dave: You are spot-on right! The major hurdle is that 70 degrees C is below the boiling temperature of water. Only a near zero relative hudity chamber will cause the ingested moisture to migrate from a package. There is one facet of the 70 degree p
Electronics Forum | Thu Oct 14 17:10:37 EDT 2010 | hegemon
Heck, now I look up and see this is SMTdotNET. Do I get banned for asking a TH question? So here's my first real TH issue after living so long in the SMT world. We are having a sudden issue in what has been a stable process for quite some time. I
Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS
Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl
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