Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2003-04-14 09:29:49.0
More than 3,000 visitors gathered in Long Beach, Calif., for IPC Printed Circuits Expo� 2003, held March 23-27
Industry News | 2017-05-02 12:23:21.0
John Mitchell, president and CEO of IPC – Association Connecting Electronics Industries®, issued the following statement on the April 29 Executive Order by President Donald Trump, creating a new White House Office on Trade and Manufacturing Policy:
Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Industry News | 2011-05-03 22:58:11.0
IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2012 IPC APEX EXPO™ at the San Diego Convention Center in San Diego, Calif. The technical conference will be held February 28–March 1, 2012, and the professional development courses will be February 26–27 and March 1, 2012.
Industry News | 2011-08-08 16:05:12.0
IPC will begin development of a data exchange standard to help the electronics manufacturing industry comply with forthcoming U.S. Securities and Exchange Commission (SEC) regulations on conflict minerals at a kickoff meeting on September 22, 2011, held in conjunction with IPC Midwest Conference & Exhibition, Schaumburg, IL.
Industry News | 2014-05-14 16:54:20.0
A newly released training video, DVD-166C, “Counterfeit Components” from IPC — Association Connecting Electronics Industries®, explains not only how counterfeit components find their way into the supply chain, but more important, how to detect fraudulent devices during visual inspection.
Industry News | 2019-12-10 16:28:35.0
The following statement can be attributed to John Mitchell, IPC president and CEO: “We are pleased that leaders in the U.S. Congress and the Trump administration, as well as the governments of Canada and Mexico and key stakeholders, have reached consensus on USMCA. The agreement is a positive step for the electronics manufacturing industry and millions of U.S. workers and consumers. By prioritizing a modernized and strengthened trade relationship between the U.S., Canada and Mexico, all three nations can strengthen the region's supply chains, expand trade opportunities with partners abroad, and reinforce North America as a bastion of strength and stability in an uncertain world.
