Industry Directory | Manufacturer
A specialty chemical and material manufacturer catering to the bare board PCB industry. The company offers a wide range of chemical products that range from Photoresist strippers to Electroless Copper to a variety of final finish products.
Industry News | 2013-05-28 14:24:37.0
Techcon Systems,announces that its offers of the month are now available on the newly launched Techcon Systems Web Store.
Samsung Techwin developed the SM451 to deal with difficult to mount components used in the production of their TV's. The SM451 is a highly accurate machine integrating gripper nozzles and a variety of cameras to cope with large components up to 100mm
New Equipment | Cleaning Equipment
Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe
Industry Directory | Consultant / Service Provider / Manufacturer
Lifecycle Electronics Manufacturing Services Provider
Used SMT Equipment | Pick and Place/Feeders
better pics: Hires pics and a movie Ok, I have a Siemens ms72A pick and place machine for sale. This is a 1990's vintage machine. This machine was originally controlled by the hp-9000 computer it came with over IEEE488 GPIB bus. Lucky for me
Technical Library | 2017-04-20 13:51:14.0
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability.
A.R.T._the answer for service to your old & new UIC PCB assembly equipment.
Western Canadian Electronic Manufacturing and Contract Manufacturing Service. Certifications ISO 9001:2008 SCC ISO 13485:2003 Controlled Goods Apple MFI
