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Reading the Fine-Pitch — IPC-7525 Updated to Deal with New Materials

Industry News | 2012-06-09 14:33:06.0

To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.

Association Connecting Electronics Industries (IPC)

Happy New Year

Industry News | 2020-12-25 07:03:46.0

The unforgettable year is coming to an end, at this special time, we ETA sending our sincerest blessings to friends at home and abroad. Wish all brothers and sisters work happy and enjoy life.

Dongguan Intercontinental Technology Co., Ltd.

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Surface Mount Technology Association (SMTA)

Europe Chapter Webinar: "Back-to-Basics" SMT Assembly

Events Calendar | Wed Jul 03 00:00:00 EDT 2024 - Wed Jul 03 00:00:00 EDT 2024 | ,

Europe Chapter Webinar: "Back-to-Basics" SMT Assembly

Surface Mount Technology Association (SMTA)

Samsung J72651383A Samsung Sme 8mm Feeder Parts

Samsung J72651383A Samsung Sme 8mm Feeder Parts

Parts & Supplies | Assembly Accessories

Samsung feeder in stock SM321 SM421 SM411 series feeder,and the details are as below Samsung SM321 SM421 SM411 8mm feeder Samsung SM321 SM421 SM411 12mm feeder Samsung SM321 SM421 SM411 16mm feeder Samsung SM321 SM421 SM411 24mm feeder Samsung

KingFei SMT Tech

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

Cleaning Up the No-Clean Myth - IPC Releases New Update of Guidelines for Cleaning of Printed Boards & Assemblies

Industry News | 2011-07-26 22:29:00.0

It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.

Association Connecting Electronics Industries (IPC)

IPC Releases Attendance Numbers for IPC Printed Circuits Expo� 2003

Industry News | 2003-04-14 09:29:49.0

More than 3,000 visitors gathered in Long Beach, Calif., for IPC Printed Circuits Expo� 2003, held March 23-27

Association Connecting Electronics Industries (IPC)

SMTA China and Hong Kong Chapter Announce the Winners of the 2011 Annual Awards

Industry News | 2011-09-06 15:15:23.0

SMTA China and Hong Kong Chapter held its annual awards presentation in conjunction with the SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.

Surface Mount Technology Association (SMTA)


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