Electronics Forum | Tue Sep 28 05:04:10 EDT 2004 | grayman
In obtaining almost zero defect in solder wave. I would like to suggest the following: First,We must consider changing machine if it is more than 5 years old. second, use the right tools for the right job. Most of the traditional engineers will us
Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef
Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an
Electronics Forum | Fri Nov 30 08:35:51 EST 2007 | stepheniii
We put glue on the bottom of the board that already has the topside SMT mounted. We populate the board. We put it through a cure profile. At this stage the topside components are soldered on. The bottom side components are glued on with NO solder on
Electronics Forum | Wed Jan 09 17:18:25 EST 2002 | pjc
Mydata, of Sweden, offers one of the best entry level placement machines that are high-tech. and very easy to program, operate and maintain. Perfect for the new user. They have excellent service and support in Europe. www.mydata.se For adhesive curin
Electronics Forum | Wed Aug 23 02:48:11 EDT 2006 | ec
Hi, Appreciate someone could advise or forward a format to me how to work out number of pallet needed for wave-solder if the machine speed is at 1.0m/min, volume per month is 4500 sets, pallet length 0.3 meter, conveyor length 5 meter...... Looking
Electronics Forum | Thu Jul 31 13:42:08 EDT 2008 | comatose
I'm looking to fill a solder fountain with 50lb of SN100C. My usual source for paste and the like doesn't stock this alloy. We run double sided reflow, so we're not going to be needing hundreds of pounds for a wave machine at any point. Who is the
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Mon Aug 21 19:38:33 EDT 2000 | Dave F
Eric: I�ll pass on the uV and ammonia, also. Thoughts are: 1 You�re correct that the temperature/humidity mix can be a big driver to latex peelable solder mask cure time, but don�t overlook material thickness. Dispensers put material in a very th
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