Industry News | 2021-08-13 12:58:35.0
The SMTA Capital Chapter, Carolinas Chapter and Philadelphia Chapter are excited to host their first ever tri-chapter event, Mid-Atlantic Advanced Learning Session - Failure is Never an Option, A Deep Dive into Failure Analysis.
Industry News | 2022-10-12 08:07:17.0
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the circuit board assembly line. The basic principle of AOI is to judge whether the object to be tested meets the standard by comparing whether there is a large difference between the object to be tested and the standard image by using image technology. AOI emits a 4-color light source to the PCBA board, which is automatically scanned by an industrial camera for catastrophic failures, such as missing components or quality defects. Therefore, the quality of AOI depends on the image imaging ability, algorithm parsing ability and image discrimination technology. I.C.T AOI has done well in these aspects.
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
Industry News | 2019-10-22 12:34:34.0
Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferred by IPC/JEDEC standard J-STD-033D.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
Industry News | 2013-01-28 21:40:10.0
ASTER Technologies has developed a major new release of TestWay, the reference in Design for Excellence (DfX), by incorporating an integrated workflow from design through to product delivery.
Technical Library | 2013-07-25 14:02:15.0
Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.
Technical Library | 2021-05-06 13:48:05.0
In this paper most commonly occurring Bare PCB defects such as Track Cut, Track short and Pad Damages are detected by Image processing techniques. Reference PCB without having any defects is compared with test PCB having defects to identify the defects and x-y coordinates of the center of the defects along with radii are obtained using Difference of Gaussian method and location of the individual type of defects are marked either by similar color or different colors. Result Analysis includes time taken for the inspection of a single defect, multiple similar defects, and multiple different defects. Time taken is ranging from 1.674 to 1.714 seconds if the individual type of defects are marked by different colors and 0.670 to 0.709 seconds if all the identified defects are marked by the same colors.
