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How to Use and Read Humidity Indicator Card Type 2 - Humitector™

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

Videos

A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi

Clariant Cargo & Device Protection

Clariant introduces innovative halogen- and cobalt dichloride-free Type 2 Non-reversible Humidity Indicator Cards to ensure integrity of moisture sensitive electronic components

Industry News | 2019-10-22 12:34:34.0

Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferred by IPC/JEDEC standard J-STD-033D.

Clariant Cargo & Device Protection

Micro-Sectioning of PCBs for Failure Analysis

Technical Library | 2010-01-13 12:34:10.0

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.

BEST Inc.

IPC-J-STD-001 Operator Recertification (CIS)

Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.

The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.

BEST Inc.

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials.

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials.

Videos

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert

BEST Inc.

TestWay - The reference in Design for Excellence (DfX)

Industry News | 2013-01-28 21:40:10.0

ASTER Technologies has developed a major new release of TestWay, the reference in Design for Excellence (DfX), by incorporating an integrated workflow from design through to product delivery.

ASTER Technologies

Using Automated 3D X-Ray Inspection to Detect BTC Defects

Technical Library | 2013-07-25 14:02:15.0

Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.

Flex (Flextronics International)

Bare PCB inspection for Track cut, Track Short and Pad Damage using simple Image Processing Operations

Technical Library | 2021-05-06 13:48:05.0

In this paper most commonly occurring Bare PCB defects such as Track Cut, Track short and Pad Damages are detected by Image processing techniques. Reference PCB without having any defects is compared with test PCB having defects to identify the defects and x-y coordinates of the center of the defects along with radii are obtained using Difference of Gaussian method and location of the individual type of defects are marked either by similar color or different colors. Result Analysis includes time taken for the inspection of a single defect, multiple similar defects, and multiple different defects. Time taken is ranging from 1.674 to 1.714 seconds if the individual type of defects are marked by different colors and 0.670 to 0.709 seconds if all the identified defects are marked by the same colors.

Vidya Vikas Institute Of Engineering And Technology

Hands-On Solder

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Skolnik Technical Training Institute, LLC

ISIS

New Equipment |  

ISIS� (Infrared Screening and Inspection Solutions) was developed to detect defects and manufacturing flaws in printed circuit boards (PCBs) that are assembled using surface mount technology (SMT). ISIS� uses infrared imaging and proprietary thermal

Advanced Research Technologies


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