Industry News | 2015-04-21 16:47:21.0
Vi TECHNOLOGY is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Software – Process Control for its Sigma Review Software. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2015-04-22 15:03:58.0
Vi TECHNOLOGY announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – SPI for its Sigma Review Software. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Introducing the industry's only true dual mode 3D SPI and AOI inspection system for the electronics manufacturing sector. The LineMaster Fusion combines the best of ASC's 3D SPI sensor technology along with cutting edge image-algorithm based AOI.
Career Center | St. Louis, Missouri USA | Production
A growing Tier 1 Automotive Supplier is seeking an SMT Process Engineer to join thier team! Primarily responsible for program and process development, analysis and troubleshooting of all Surface Mount Technology (SMT) processes and equipment. Must
Career Center | Glen Cove, New York USA | Production
MULTIDYNE is seeking a qualified candidate with the ability to set up and operate a MyData pick and place SMT machine and soldering reflow oven. The candidate must: • Show experience with SMT electronics, manufacturing and troubleshooting. •
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
Industry News | 2017-05-21 10:12:34.0
Cleaning printed circuit boards has become more popular again due to the complexity of many board assemblies and coupled with the use of conformal coating. Products are often exposed to environments that often result in failures if bare boards or assemblies are no cleaned see http://www.bobwillis.co.uk
Industry News | 2018-08-23 06:31:30.0
Our cleaning and contamination photo album has been updated with more video clips to make your training session come alive and available as a download from our website
Simultaneous Pickup Solution with One Feeder, Highest Speed LED Production System in the World The world's first SLM100 Series LED mounter capable of realizing simultaneous pickup with one feeder. It provides an optimum LED production system. Sim