Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Used SMT Equipment | Pick and Place/Feeders
YAMAHA YSM20R SMT Placement Modular SMT Machine Model YSM20R TypePV YSM20R TypeSV YSM20WR Applicable PCB Single laneL810 x W490 to L50 x W50Dual stage Note: For X-axis 2-beam option only 1PCB conveyance: L810 x W490 to L50 x W50 2P
Used SMT Equipment | Chipshooters / Chip Mounters
Superb mounting performance 95,000 CPH (under optimum conditions as defined by Yamaha Motor) Needs no head replacement! 0201mm to large-size components YSR20 With sATS30NS Auto Tray (ATS)
Used SMT Equipment | Pick and Place/Feeders
Applicable PCB L510 x W460mm to L50 x W50mm Note: Available in lengths up to L610mm as an option Applicable components03015 to W55 x L100mm (For parts sizes larger the width 45mm, recognition of parts is divided into sections.), Height 15mm or
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 2 of 3)
Used SMT Equipment | Pick and Place/Feeders
Model Name: YSM20R 5% faster than the YSM20. Featuring a new wide-scan camera with improved component adaptability Applicable PCB: PCB conveyance : L810 x W490 to L50 x W50 2 PCB conveyance : L380 x W490 to L50 x W50 Mounting capability: X axis 2
Technical Library | 2020-04-14 15:49:38.0
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.
Training Courses | ON DEMAND | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
