Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource / Other
PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
Industry Directory | Consultant / Service Provider
Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
EasyCoat® 6 software for conformal coating systems delivers intuitive visual programming Nordson ASYMTEK's EasyCoat® software provides precise conformal coating with process control, traceability, and intuitive visual programming for conformal coati
Electronics Forum | Wed Dec 08 19:50:34 EST 2004 | shen_zte
can anyone tell me the benifit of the solder mask onto pad(part) or pad defined by solder mask?and how to excute the SMT process ? thanks.
Electronics Forum | Fri Dec 10 08:42:37 EST 2004 | mattkehoe
We had some bad experiences trying to work with soldermask defined BGA pads. If the opening in the soldermask is right to the edge of the copper/pad without a space it can leave reside on the pad and nothing will stick to it. See http://www.sipad.com
Used SMT Equipment | Pick and Place/Feeders
YAMAHA YSM20R SMT Placement Modular SMT Machine Model YSM20R TypePV YSM20R TypeSV YSM20WR Applicable PCB Single laneL810 x W490 to L50 x W50Dual stage Note: For X-axis 2-beam option only 1PCB conveyance: L810 x W490 to L50 x W50 2P
Used SMT Equipment | Chipshooters / Chip Mounters
Superb mounting performance 95,000 CPH (under optimum conditions as defined by Yamaha Motor) Needs no head replacement! 0201mm to large-size components YSR20 With sATS30NS Auto Tray (ATS)
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2003-05-29 08:48:10.0
As a consequence of the negotiations the operations of the factory will be notably downsized.
Technical Library | 2007-08-28 20:18:06.0
A conformal coating is defined as a thin polymeric material which covers the surface of an electronic assembly. These coatings are used to provide an electrically insulative and environmentally protective seal or cover to a completed printed circuit board (PCB).
Technical Library | 1999-08-05 09:51:47.0
This document summarizes the finding of testing to determine the immunity of semiconductor equipment to voltage sag events. Based in part on the findings, global standards have been adopted to define voltage sag immunity requirements for semiconductor equipment...
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Yamaha YSM20WR Modular SMT Placement ❙ Features of Yamaha YSM20R High-efficiency modular Yamaha SMT placement, Yamaha chip mounter YSM20R, applicable components 0201 to W55 x L100mm, Height 15mm or less, placement
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Training Courses | ON DEMAND | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 2 of 3)
Career Center | , Arizona USA | Engineering,Production
Position requires an Engineering degree with 4 years experience with SMT equipment preferably FUJI. Programs equipment, maintain profiles, defines process, tooling and standards. Recommends and implement cost reduction approaches.
Career Center | Woburn, Massachusetts USA | Sales/Marketing
We seek an ambitious, technically adept professional to develop and maintain business relationships with OEM�s and Contract Manufacturers. As a Professional Sales Engineer, you will represent PCC with potential & existing customers within a defin
Career Center | kemaman, malaysia Philippines | Maintenance,Production,Technical Support
• Conduct repairs and troubleshooting of production equipment to avoid / minimize production downtime. • Performs preventive maintenance of production equipment as defined in work procedure and according to their schedule of frequency. • C
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Management,Production,Purchasing,Technical Support
Innovation/Creativity Cost Saving Strategies Employee Motivation Customer Service Focus Program, Repair and Maintenance New Product Development Continuous Improvement Training & Development Process Planning & Labour O
Horizontal Convection Reflow Technology Defined Horizontal Convection Reflow Technology Defined Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct
| https://unisoft-cim.com/rotation-modification-options-etc.html
. How rotations are determined in CAD files: CAD FILES "WITHOUT" EXPLICITLY DEFINED COMPONENT ROTATIONS: Some CAD files such as IPC-D-356, Unisoft FBA, etc
| https://www.eptac.com/wp-content/uploads/2020/01/eptac_webinar_02-19-20.pdf
? • When do we use them? 2 Where, What and Why • Where are they defined: • Section 1.5 Definition of Requirements: • What: • The words SHALL or SHALL NOT are used in the text whenever there is a requirement for materials, preparation, process control or acceptance of a solder connection
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