Electronics Forum | Thu Nov 30 04:02:26 EST 2000 | Chris May
Michael, Thanks for your response. More info:- The processes are as follows, Stencil Print (6 thou on DEK 248) Placement on Contact 3AV and Reflow on BTU 4 zone Top & Bottom oven.It is not an In-Line system. Our board technology is mixed but heavi
Electronics Forum | Tue Jul 16 07:59:14 EDT 2002 | hany_khoga
Hello there: 1- I know someone who diluted expired solder paste, which obviously lost its tackiness using Isopropanol. The paste was expired by more than 6monthes but after dilution I saw by myself the paste has retrieved its tackiness. The amazing
Electronics Forum | Mon Oct 14 10:53:28 EDT 2013 | emeto
0.5 if you use electroformed stencil or > 0.8 if you use laser cut. 2. Always use fresh paste 3. Uses the right printer parameters for your paste(for example Alpha likes fast release of the stencil from the board - in DEK this is called separation s
Electronics Forum | Fri Aug 18 09:19:01 EDT 2000 | PR
We have been using the Pro Flo for about a year and the print quality alone is worth making the move. It is flexible in that switching over to blades is pretty simple (if you need to), and the operators love it because clean up is a breeze. The only
Electronics Forum | Fri Sep 06 11:58:21 EDT 2002 | Brian W.
The most effective method is to monitor both printing results and parameters. Periodically (maybe once per month), run QCCalc or another program to measure the machine's capability to hold its set parameters. I also run control charts on the paste h
Electronics Forum | Tue Mar 30 02:32:42 EST 1999 | Scott Davies
We have carried out some experimental work, in conjunction with DEK. Instead of dispensing adhesive for SMD components onto the bottom side of on of our PCBs, we have looked at the possibility of screen printing the adhesive. Because, at the stage of
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Wed Mar 27 16:54:47 EST 2002 | davef
STARTING RANGES * Pressure � 1 pound/inch of blade (metal); 1.6-3 pound/inch (plastic) * Speed - 0.5 to 3 inch per sec [for standard pitch]; 0.5 to 1 inch per sec [for fine pitch] Your paste supplier�s recommendation is a good place to start. * Sepa
Electronics Forum | Wed Mar 31 14:30:11 EST 1999 | Dave F
| We have carried out some experimental work, in conjunction with DEK. Instead of dispensing adhesive for SMD components onto the bottom side of on of our PCBs, we have looked at the possibility of screen printing the adhesive. Because, at the stage
Electronics Forum | Tue Jan 12 19:07:07 EST 1999 | Earl Moon
| | For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | | | It appears to me that there are two options: | | A: to have a pn chart bas
