Full Site - : dek proflow head printing (Page 7 of 27)

DEK to showcase product & process innovation at Productronica, Stand A2.405

Industry News | 2009-10-22 13:23:47.0

The DEK team is currently looking forward to showcasing an extensive range of innovative technologies from Stand A2.405 at this year’s Productronica exhibition, including its newly re-energized Horizon platform. Being held from 10th – 13th November in Munich, the 18th International trade fair for innovative electronics production will also host a wide range of DEK Productivity Tools along with the company’s brand new Sentinel technology.

ASM Assembly Systems (DEK)

DEK Celebrates its 40th

Industry News | 2008-04-29 22:59:31.0

Celebrating 40 years in business, mass imaging specialist DEK is using this significant milestone to reaffirm its longstanding commitment to providing customers with innovative solutions.

ASM Assembly Systems (DEK)

DEK Eyes Opportunities at Upcoming IPC Midwest Event

Industry News | 2009-09-17 17:10:31.0

While the electronics industry continues to adjust to the effects of a fragile global economy, mass imaging leader DEK is pushing forward with innovation initiatives and technology investments, viewing the recent downturn as an opportunity to further strengthen its market leadership position. Visitors to the IPC Midwest event, scheduled to take place September 23 and 24 in Schaumburg, Illinois, can see first-hand the result of the company’s ongoing innovation commitment.

ASM Assembly Systems (DEK)

DEK Gives APEX Attendees Look at Future-Proofed Technologies

Industry News | 2009-03-17 04:47:26.0

From DEK booth #2412 at this year's APEX event, being held over March 31 � April 2 in Las Vegas, Nevada, visitors will witness the ultimate in product versatility and choice for a truly future-proofed investment and productivity advantage.

ASM Assembly Systems (DEK)

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

DEK Stencil Printer Horizon 8

DEK Stencil Printer Horizon 8

New Equipment | Printing

2 Cpk @ +/-25 microns 6-Sigma  INQUIRY DEK Stencil Printer Horizon 8 Specifications: DEK’s Horizon platforms offer a comprehensive array of sophisticated features as standard, including optimised printer frame technology, fast product chang

Fomyn Equipment co,.ltd

Technology Speeds Adhesive Deposition

Industry News | 2003-05-21 08:51:07.0

DEK has added a new section to its website that consolidates information on the benefits of using PumpPrint process technology for high-speed adhesive deposition.

ASM Assembly Systems (DEK)

DEK Europa Screen Printer

DEK Europa Screen Printer

Used SMT Equipment | Screen Printers

Late model DEK with 2D inspection. Can be used with blades or available ProFlow heads 2D inspection CyberOptics Green camera Grid-Lok Tooling Vortex vacuum stencil clean (paperless) Adjustable stencil sizes Manuals & acce

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Blackfox IPC Training & Certification

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Software for SMT placement & AOI - Free Download.
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