Industry News | 2018-02-02 18:44:38.0
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
Industry News | 2018-03-05 16:24:46.0
IPC — Association Connecting Electronics Industries® announces the appointment of Chris Mitchell as its new vice president of global government relations. Mitchell starts his new position today, March 5, 2018, and will be based in IPC’s Washington, D.C. office.
Industry News | 2018-11-01 07:45:27.0
Leaders of the U.S. electronics industry today unveiled the IPC Workforce Champions program and pledged to create at least 1 million new skilled workforce opportunities over the next five years.
Industry News | 2019-07-22 18:12:05.0
Washington, D.C. – The Trump administration this week is recognizing IPC – Association Connecting Electronics Industries® and several of its member companies for their efforts to expand the skilled workforce.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2012-02-07 00:51:20.0
A key enabling technology that is making a significant impact in consumer, commercial, medical and specialty electronics markets, printed electronics is coming of age at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. IPC APEX EXPO will feature a dedicated printed electronics area on the show floor, a printed electronics track in the technical conference, and historic standards development meetings where the first-ever industry requirements for the manufacture and assembly of printed electronics will be discussed and developed.
Industry News | 2003-04-10 10:27:46.0
IPC and JEDEC Send Out Call for Papers
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2010-04-10 02:49:43.0
The Nominating and Governance Committee of the IPC Board of Directors presented six candidates for election at the IPC Annual Meeting, on Tuesday, April 6, 2010, in conjunction with IPC APEX EXPO™ in Las Vegas. Three candidates were elected as board officers and will serve two-year terms covering April 2010 through March 2012. The other three candidates were elected as board directors and will serve four-year terms, covering April 2010 through March 2014.
Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
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