Industry News | 2010-01-22 21:20:50.0
DEK recently encouraged its customers to become ‘de-DEK-tives’ in order to triumph in a prize draw held on its stand at Munich’s Productronica exhibition. Having now revealed the competition winner as Siemens AG’s Mr. Stanek, DEK has successfully drawn attention to the critical nature of stencil design in relation to ongoing product reliability – with a little help from Sherlock Holmes and Dr. Watson.
Industry News | 2009-05-11 11:56:14.0
DEK recently unveiled its brand new Verification & Traceability Software Suite at this year's Apex exhibition in Las Vegas. This innovative technology delivers effective process control and workflow support through proactive verification of product file settings and traceability to board level.
Industry News | 2008-06-26 14:36:27.0
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 � 17 at San Francisco�s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard� Platinum stencil technology.
Industry News | 2010-01-07 20:19:27.0
Mass imaging specialist DEK has unveiled further enhancements to its popular Horizon screen printing platform. Now equipped with state-of-the-art new cover packages, Horizon features substantially improved usability and operator access for an additional level of manufacturing flexibility.
Industry News | 2009-04-27 18:00:47.0
DEK has launched its brand new Stinger* technology, an integrated low volume adhesive dispense module enabling dual function capability from a single screen printing platform. Ideal for customers working with mixed technology boards for example, Stinger is an easy-to-use, flexible system featuring innovative patented technology to eliminate unnecessary stoppages and raise productivity.
Industry News | 2009-03-17 04:47:26.0
From DEK booth #2412 at this year's APEX event, being held over March 31 � April 2 in Las Vegas, Nevada, visitors will witness the ultimate in product versatility and choice for a truly future-proofed investment and productivity advantage.
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
Product introduction Double deck cross worktable moving structure, many kinds of probe modes is combined such as touch-probe system and optical image system. CCD imaging technology and advanced image-processing technology are combined too. This machi
Industry News | 2009-09-17 17:10:31.0
While the electronics industry continues to adjust to the effects of a fragile global economy, mass imaging leader DEK is pushing forward with innovation initiatives and technology investments, viewing the recent downturn as an opportunity to further strengthen its market leadership position. Visitors to the IPC Midwest event, scheduled to take place September 23 and 24 in Schaumburg, Illinois, can see first-hand the result of the company’s ongoing innovation commitment.
Industry News | 2016-04-07 16:17:04.0
ASM Assembly Systems can look back on a very successful APEX 2016 trade show. The two lines being shown, one a high-speed line with the latest DEK NeoHorizon and SIPLACE TX modules and the other a high-mix line with super-flexible SIPLACE SX, attracted lots of visitors. The industry professionals were especially impressed that ASM already has concrete products for its Smart #1 SMT Factory concept in its portfolio, making it the leading technology partner for the future of electronics manufacturing. One of these products was the SIPLACE BulkFeeder, an innovative feeder module for high-volume production that trade publication Circuit Assembly immediately honored with its highly respective NPI Award. The SIPLACE BulkFeeder holds up to 1.5 million loose components and feeds them with exceptional precision – without tapes or splicing and the associated risks. The concept of the ASM ProcessExpert is equally revolutionary. With its integrated 5D SPM (solder paste management) system, the world's first inline expert systems controls and optimizes printing processes fully automatically. Another innovation was shown at the booth of ASM distributor Technica: With the E by SIPLACE, ASM addresses customers and applications in the mid-speed, small-lot and prototype manufacturing segments.
