Industry News | 2015-10-11 15:35:54.0
New placement modules, tapeless feeders, new screen printers and the first expert system that optimizes SMT processes automatically. At Productronica 2015 (November 10-13, Munich Trade Fair Center), technology leader ASM Assembly Systems will present a show unlike any other under the motto “On the move to the Smart #1 SMT Factory”. On 650 square meters at booth A3.377, the SMT experts will lay out their roadmap to the Smart Factory with a “Speed Quality” line and a “Flexible Quality” line featuring totally innovative technologies. The focus will be best-in-class equipment, automation tools, production process networking and integration, and transparent material logistics. At the “Speed Quality” line, new SIPLACE TX placement modules will ring in the mass placement of super-small 0201 (metric) components. A single SIPLACE TX module alone can place up to 78,000 of these per hour at full speed at smallest footprint. With its compact design, it also sets new records in speed, floorspace performance and placement accuracy. Components in sizes from 0402 through 01005 will be supplied loosely and without tapes thanks to the new SIPLACE BulkFeeder. This ASM innovation finally bans reels and splicing from the SMT production floor. With the DEK NeoHorizon and DEK NeoHorizon Back-to-Back, the ASM team will also unveil new, powerful screen printers. Most of the visitors’ attention, however, will be focused on the ASM ProcessExpert. This first inline expert system in the industry establishes a new product category in electronics manufacturing. By running virtual prints based on Gerber data, the ASM ProcessExpert subjects the stencil to a DFM (design for manufacturability) health check. By stabilizing and optimizing the printing process automatically, this highly innovative system represents a milestone on the path to self-optimizing SMT lines. Each of these innovations constitutes a building block for the Smart Factory.
Used SMT Equipment | Soldering - Reflow
SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax F6 systems provide optimized lead-f
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 xbox one controller motherboard repair machine price WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main use
New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 all motherboard repair machine for iphone PS4 repairing WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main u
Industry News | 2016-04-07 16:17:04.0
ASM Assembly Systems can look back on a very successful APEX 2016 trade show. The two lines being shown, one a high-speed line with the latest DEK NeoHorizon and SIPLACE TX modules and the other a high-mix line with super-flexible SIPLACE SX, attracted lots of visitors. The industry professionals were especially impressed that ASM already has concrete products for its Smart #1 SMT Factory concept in its portfolio, making it the leading technology partner for the future of electronics manufacturing. One of these products was the SIPLACE BulkFeeder, an innovative feeder module for high-volume production that trade publication Circuit Assembly immediately honored with its highly respective NPI Award. The SIPLACE BulkFeeder holds up to 1.5 million loose components and feeds them with exceptional precision – without tapes or splicing and the associated risks. The concept of the ASM ProcessExpert is equally revolutionary. With its integrated 5D SPM (solder paste management) system, the world's first inline expert systems controls and optimizes printing processes fully automatically. Another innovation was shown at the booth of ASM distributor Technica: With the E by SIPLACE, ASM addresses customers and applications in the mid-speed, small-lot and prototype manufacturing segments.
The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i
ScanINSPECT BGA provides a fast, simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, yet slow, measurement systems. ScanINSPECT BGA uses an intuitive process flow interface integrated with a
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
Easy to Use The A500 is the easiest to use fully automatic SPI system. The user simply loads a Gerber 274-X file for the PCB panel to be inspected, locks down the panel on the board holder and hits the play button. The system takes over from there,
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