New SMT Equipment: delamination of flex (1)

S3088 flex - High-speed AOI of Fine-pitch Components

S3088 flex - High-speed AOI of Fine-pitch Components

New Equipment | Inspection

Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering. The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexib

Viscom AG

Electronics Forum: delamination of flex (95)

Pre-bake of Polyimide flex ? ?

Electronics Forum | Wed Jan 05 17:53:52 EST 2005 | SuePH

We had a contract in house that included a flex board which required an 18 hour bake at 105 degrees. The other brds got along fine with 2 hours, but the flex board would delaminate until we went to this long bake. I don't know how the engineer came

Pre-bake of Polyimide flex ? ?

Electronics Forum | Wed Dec 22 19:09:17 EST 2004 | rohman23

Very strange...I just logged into the internet to come post this very question for all the lurking experts. We have a 16 layer rigid-flex that we have never baked. Our board vendor is expressing concern that we do not perform a pre-bake before assy

Used SMT Equipment: delamination of flex (2)

Panasonic Lot of Conveyors

Panasonic Lot of Conveyors

Used SMT Equipment | Conveyors

Lot includes: (1) Panasonic Vacuum Style Bare Board Loader (1) Panasonic .5m Conveyor (1) Panasonic Workstation Conveyor (1) Panasonic Shuttle Gate (1) Panasonic Turn Unit (1) Panasonic Long (110") Transfer Conveyor (1) Panasonic Transfe

Lewis & Clark

Mydata Lot of Feeders

Mydata Lot of Feeders

Used SMT Equipment | Pick and Place/Feeders

Mydata Feeders available...buy the whole lot or buy them individually:   Magazine Type with EIN TM8  EIN1011926 TM8  EIN1055552 TM8  EIN1011925 TM8  EIN1055582 TM8  EIN1055550 TM8  EIN1055581 TM12  EIN1055584 TMC FLEX  EIN

Capital Equipment Exchange

Industry News: delamination of flex (61)

Titan Signs Letter of Intent to Buy EMC

Industry News | 2003-02-21 09:21:43.0

Titan General Holdings Inc. is buying substantially all the assets of Eastern Manufacturing Corp.

SMTnet

Lenthor Engineering Announces The Acquisition of P.C.B. Engineering

Industry News | 2003-05-01 09:03:53.0

The newly formed company can now readily offer their combined customer base the most comprehensive portfolio of the most advanced engineering and manufacturing services in the industry.

SMTnet

Parts & Supplies: delamination of flex (8)

MPM Scraper of MOMENTUM/MPM125

MPM Scraper of MOMENTUM/MPM125

Parts & Supplies | Screen Printers

MPM UP2000 (MPM UP100/200/500/1500 / REPRINT MPM125) 1 MPM UP2000 steel blade 6 inch "152.4mm, doctor blade width 32mm" 2 MPM UP2000 steel blade 8 inch "203.2mm, doctor blade width 32mm" 3 MPM UP2000 steel blade 10 inch "254mm, doctor blade w

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM Scraper of MOMENTUM/MPM125

MPM Scraper of MOMENTUM/MPM125

Parts & Supplies | SMT Equipment

MPM UP2000 (MPM UP100/200/500/1500 / REPRINT MPM125) 1 MPM UP2000 steel blade 6 inch "152.4mm, doctor blade width 32mm" 2 MPM UP2000 steel blade 8 inch "203.2mm, doctor blade width 32mm" 3 MPM UP2000 steel blade 10 inch "254mm, doctor blade widt

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: delamination of flex (12)

Guidelines/recommendations "Drying of PCBs before soldering"

Technical Library | 2024-02-05 17:51:01.0

Objective:  Drying = reducing the humidity in PCB before soldering  Preventing delamination caused by thermal stress after moisture absorption Methods:  Drying in convection and/ or vacuum oven  Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)

ZVEI - German Electro and Digital Industry Association

Influence of Plating Quality on Reliability of Microvias

Technical Library | 2016-05-12 16:29:40.0

Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.

CALCE Center for Advanced Life Cycle Engineering

Videos: delamination of flex (45)

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

How to make sure you're using the most recent revision of IPC standards

How to make sure you're using the most recent revision of IPC standards

Videos

IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.

Association Connecting Electronics Industries (IPC)

Training Courses: delamination of flex (3)

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies Training and Certification Program

Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

PIEK International Education Centre

Events Calendar: delamination of flex (1)

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Express Newsletter: delamination of flex (245)

Partner Websites: delamination of flex (7363)

21 EWS Delamination vs Measles.PPT

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_09_16_09.pdf

” box Measles Delamination Crazing 4 Measles  What are they?  A separation of the epoxy from the fiberglass fiber bundles at the intersection of the warp and weft of the yarn fibers. 5 Measles  6 Measles  7 Measles  8 Delamination

Assure Flex

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-counting-systems/assure-flex

Assure Flex X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery

ASYMTEK Products | Nordson Electronics Solutions


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ISVI High Resolution Fast Speed Industrial Cameras

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World's Best Reflow Oven Customizable for Unique Applications
Selective soldering solutions with Jade soldering machine

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