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Used SMT Equipment | Pick and Place/Feeders
YS12F Specification: Applicable PCB: L510mm x W460mm to L50mm x W50mm Mounting accuracy: Absolute accuracy(μ+3σ) +/-0.05mm/CHIP Mounting tact: 20,000CPH(under our optimum condition) Component supply: Tape reel, tray Number of component
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Parts & Supplies | Pick and Place/Feeders
PANASONIC - FEEDER Component Feeder Unit N610071918AA We also supply following Panasonic Spare parts : 30862CA100AD CONTROLLER(MAIN) N1F8CC2 BOARD(CC) N1F82024B BOARD(NC) N209NBC1C4BM BOARD(CPU) N1F87734
Parts & Supplies | Board Cleaners
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Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.