Industry News | 2012-01-10 19:20:12.0
IPC announced the winning research papers selected in the 2012 IPC International Academic Paper Competition.
New Equipment | Test Equipment
Military-style laboratory services to validate bare boards for product assurance. Testing for delamination, voids, copper thickness, hole quality, proper stack-up, etc. Customer receives all cross-section pucks, boards and laboratory report with reco
Industry News | 2011-04-29 17:37:45.0
After the 2011 IPC APEX show in Las Vegas, DIVSYS members were ecstatic over the interest in PC Boards Without The Risk, "Green Light" Product Acceptance Testing, receiving two service awards (Technology and Quality), being invited to speak at the Women In Electronics Breakfast, and introducing General Motors Components Holding Group(GMCH)to our customers.
Industry News | 2019-05-31 08:50:57.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2019-05-31 08:56:07.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2014-02-21 12:50:41.0
Kyzen today announced that Mike Bixenman, DBA, CTO, and David Lober will present at five separate technical sessions at IPC APEX EXPO in Las Vegas in March.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Tue May 06 23:16:20 EDT 2008 | hhorse
Could you tell me how to detect PCB delamination issue? through cross section, SAM or others?
Electronics Forum | Tue Oct 24 11:00:56 EDT 2006 | SWAG
I'm not sure why that was done. They based that decision on what they saw in cross-sectional analysis of the failures.
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
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