Full Site - : delamination versus cross-section (Page 4 of 4)

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 14:19:47 EDT 1999 | Earl Moon

| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the

Re: Drying ICs any advice

Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson

| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin

Re: IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Tue Sep 28 04:16:18 EDT 1999 | Brian

| | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding

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