Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8711C Base Frequency: 300 KHz Max Frequency: 1.3 GHz The HP Agilent 8711C is a Network Analyzer with a 300 kHz to 1.3 GHz range. The HP Agilent 8711C, Network Analyzer, has a large 9 inch display or a compatible VGA monitor can
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8711C Base Frequency: 300 KHz Max Frequency: 1.3 GHz The HP Agilent 8711C is a Network Analyzer with a 300 kHz to 1.3 GHz range. The HP Agilent 8711C, Network Analyzer, has a large 9 inch display or a compatible VGA monitor can
Industry News | 2002-04-05 08:29:22.0
Detected an Undisclosed Error With Its CDMA2000 1X MSM5100 and MSM5105 Chip Sets and Software
Industry News | 2008-01-21 13:24:32.0
Additive ECO process on bare PCB saves weeks
Industry News | 2017-08-14 15:08:56.0
Multiple Features on this series of high precision high DC voltage supplies that offer many operational modes means that they can suit a variety of test and operational applications
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Technical Library | 2020-12-16 18:50:42.0
System operating speeds continue to increase as a function of the consumer demand for such technologies as faster Internet connectivity, video on demand, and mobile communications technology. As a result, new high performance PCB substrates have emerged to address signal integrity issues at higher operating frequencies. These are commonly called low Dk and/or low loss (Df) materials. The published "typical" values found on a product data sheet provide limited information, usually a single construction and resin content, and are derived from a wide range of test methods and test sample configurations. A printed circuit board designer or front end application engineer must be aware that making a design decision based on the limited information found on a product data sheet can lead to errors which can delay a product launch or increase the assembled PCB cost. The purpose of this paper is to highlight critical selection factors that go beyond a typical product data sheet and explain how these factors must be considered when selecting materials for high speed applications
X/Y/Z axis high quality step motor and it's driving system , ensure stable and precise run of motion system. Tiltable platform with 90 degree rotation realize no dead angle glue dispensing. Customized glue feeding system and valve meet differen
Industry News | 2016-08-18 16:01:12.0
Using all digital techniques. the TGP3100 series can surpass the capabilities of traditional pulse generators while adding features such as pulse modulations.
Since 1986, C.E. Precision Assemblies, Inc. (CEPA) has buiilt a reputation of producing and delivering quality products for aerospace, military, and commercial interconnect applications. Our goal is to contunue providing high quality products that m
