Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Electronics Forum | Mon Jul 26 06:19:51 EDT 2010 | grld_fischer
Hello All, I am brand new to PCB design and I came across this forum while browsing. It’s very interesting to meet members here sharing information on PCB designing. I came across few articles on web regarding DFM(Design for Manufacturability) metho
Electronics Forum | Fri Jun 19 07:49:03 EDT 2020 | alanyang
Hope it's helpful for this stencil design.https://pcbboardassembly.com/how-to-understand-ipc-7525a-stencil-design-guidelines/
Used SMT Equipment | AOI / Automated Optical Inspection
2014 Mirtec MV-7 Omni In-line AOI Machine Make: Mirtec Model: MV-7 Vintage: 2014 Description: In-line AOI Details: Five Camera 2D/3D In-Line AOI SystemExclusive FIFTEEN MEGA PIXEL ISIS® Vision SystemAdvanced Six Phase Color Lighting Technology10 Micr
Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 2077 Products in detail Features: High speed dispensing/adapt to more stablerange Equal to KE series ofhigh-performance/operability Attaches great importance to thecompatibility and environment design Parameters: Substrate
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Model NO. : GW-UL250L , GW- UL330L ,GW- UL390L ,GW- UL460L PCB size(L×W)~(L×W) :(50×50)~(350×250),(50×50)~(455×330),(50×50)~(530×390),(50×50)~(530×460), Machine size (L×W×H) : 1370×750×1200 , 15
Parts & Supplies | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Wed Apr 14 00:00:00 EDT 2021 - Wed Apr 14 00:00:00 EDT 2021 | ,
Puget Sound Webinar: PCB Design, Fabrication, and Assembly DFM Webinar
Events Calendar | Tue Jan 30 00:00:00 EST 2024 - Thu Feb 01 00:00:00 EST 2024 | Santa Clara, California USA
SMTA at DesignCon
Career Center | San Jose, California USA | Engineering
Headquartered in San Jose, as leading PC component distributor and rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR, SD-RAM, SO-DIMM and F
Career Center | Fremont, California USA | Engineering
Job Description: • Has full ownership of HW design and release including HW specification creation, schematic generation, PCB layout, board bring up, and design verification. • Complete PCB design schematic using Orcad capture. • Complete HW desig
Career Center | Newport Beach, California USA | Engineering,Management,Production
KEVIN RAGER P.O.BOX 7878, NEWPORT BEACH, 949 922 8997, KEVIN.RAGER@EDA-INC.US OBJECTIVE I am trying to find a consistent work flow that provides mentally challenging yet stimulating experiences in design and prototype development. EXPERIENCE 1997
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
Design Authors: Leonard Marks and James A. Cateri
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/brand/identity/layout-application-and-design-grids
Layout Design Grids Nordson Brand Management NASDAQ $221.63 -2.40 Home Brand Overview What is the Nordson brand? Philosophy, Goals & Values Nordson Brand Promise Brand Architecture Master brand and sub-brands Trademarks
ORION Industries | http://orionindustries.com/about.php
Custom Parts Design ISO 9001:2015 Registered AS 9100 Registered UL Recognized SAM Registered ROHS Compliance About Orion Industries Custom Design Founded in 1973, Orion Industries Incorporated manufactures custom parts
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