DMD is an R2 certified electronics recycling provider that focuses on disposing your obsolete equipment in the safest way possible.
Industry Directory | Manufacturer
Buyers of Scrap Materials and Surplus Machinery, Equipment and Inventories Precious Metal Refining Warehouse Liquidation PCB & Electronic Scrap Recycling Purchasing of Used Surplus Semiconductor
Photochromic Polarized Lens This new item is developed based on our polycarbonate polarized lens technology. Our photochromic dye is spread in the polycarbonate layer, not coated on the surface of the lenses. It means the photochromic function wi
Albendazole CAS no. 54965-21-8 is an organic compound having Mol . formula C12 H15 N3O2S , mol. Wt 265.33 gm. /mol. is a white to off white powder form. It is associated with the family of Benzimidazole and hence an important derivative of Benzimidaz
Electronics Forum | Mon Nov 06 10:09:06 EST 2006 | slthomas
Or at the very least, destroying the blower bearings.
Electronics Forum | Wed Feb 14 16:00:50 EST 2018 | cbart
We have used it,, mixed results, cleans well, but can as you would imagine destroy plastic, i've had operators soak product and that caused problems, it also destroys any marking labels. we also use different Saponifiers to remove residues in the pas
Used SMT Equipment | SMT Equipment
Features: 1. Heating system 1.1 Independent heating models are located with top and bottom with single hot air circulation in each zone. 1.2 All the heating zones are controlled by PLC through PLD, 1.3 Each zone is heated step by step, thus reducin
Industry News | 2010-10-04 17:26:28.0
Industry-leading associations IPC and SMTA jointly announce the chairs of Workshop 2 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2011-06-16 13:19:38.0
Counterfeit products are reported to have grown to a $600 billion business worldwide. The electronics assembly industry has been impacted, with reports of counterfeit feeders, spare parts and software causing equipment breakdowns and production delays. To assist IPC member companies in keeping their equipment and lines running, the Surface Mount Equipment Manufacturers Association (SMEMA) Council of IPC – Association Connecting Electronics Industries® is creating an “anti-counterfeit tool kit.”
Parts & Supplies | Pick and Place/Feeders
FUJI XPF Vacuum Destruction PIN Fuji Mounter Parts 2AGGHB001400 Model: FUJI Mounter Specification: XPF vacuum destroy PIN Part number: 2AGGHB001400 Name: XPF Vacuum Destruction PIN 2AGGHB00100 AGGPH8601 FUJI XPF upper cover 2AGGHB001300 FUJI
Parts & Supplies | Pick and Place/Feeders
N510042548AA SENSOR MTNS000238AA SENSOR N610102197AA SENSOR MTNS000232AA SENSOR N510042549AA SENSOR N610076231AA SENSOR MTNS000430AA SENSOR MTNS000431AA SENSOR N510068524AA SENSOR N510068525AA SENSOR N510068526AA SENSOR N5100685
Technical Library | 2015-07-21 13:50:37.0
Achieving an even coat at the right desired thickness is a major challenge when it comes to applying conformal coating to a Printed Circuit Board (PCB). Applying a coating too thin will ultimately render the electronic assembly vulnerable to potential environmental risks therefore defeating the purpose of the coating. Apply the coat too thick, and it could leave the electronic specific components non-functional therefore destroying the electronic assembly entirely. Coating thickness must meet quality specifications. Measurements for coating thickness may be taken while film is dry or wet. Once measurements are recorded, thickness is compared to quality specifications and fluid dispensing automation machinery is calibrated as necessary. There are a handful of methods for measuring conformal coating thickness that are commonly used in the Electronic Manufacturing Services (EMS) and Original Electronic Manufacturer (OEM) industries. A few commonly used methods for checking conformal coating thickness include:
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
The X-Plane™ option uses a proprietary, patent applied for, tomosynthesis (or CT) technique to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image qual
The X-Plane™ option uses a proprietary, patent applied for, tomosynthesis (or CT) technique to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image qual
Career Center | Chesterland, Ohio USA | Production
Surface Grinder/Lapper Operator Position Overview We currently have an excellent career opportunity for a Surface Grinder/Lapper Operator to join our Ceramics team at our Channel Products, Inc. facility in Chesterland, OH. This position is respons
Career Center | Port Harcourt, Argentina | Management
Hold strong background in electronic repairs
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-flow-near-through-hole-component-body
– Touching Through Hole Component Body. The intent is that the solder can climb up the lead, but not touch the body. When solder touches the body it can destroy the seal where the lead enters the body of the component and this could cause failures in the component by allowing moisture to enter the component and
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_dismantling-skill-of-smt-processing_topic2356.xml
. Otherwise, if forced dismantling, it will be easy to destroy SMD components. The mastery of these techniques is of course practiced. Roughly divided into three cases, here ALLPCB would like to share the below points: 1.