Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Wed Jul 09 16:01:10 EDT 2003 | russ
Mike, the one pad that is "small" definitely appears to be over etching (It looks like it was supposed to be much larger). What is the dims of this little bugger as compared to the Gerber? i would also tend to believe that there probably is some mask
Electronics Forum | Tue Dec 21 18:08:40 EST 2010 | cbroegger
Hi Gary. I have the same problem on my Siplace feeders, and have tried different products like you have. This is what I have experienced so far: The "bag sealer" method does not really work well. Problem is that the tape foil type (plastic type) var
Electronics Forum | Wed Apr 13 12:10:47 EDT 2022 | winston_one
Hello! We have a strange effect. Some pads of big trough-hole DDR slot just dessapear. Initialy it was soldered with selective soldering process (leaded, 290 degrees, ImSn finish, very short storage). Then some connectors with poor barrel fill we hav
Electronics Forum | Fri Oct 02 01:21:08 EDT 1998 | Mike Cox
Kyung Sam, | | Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or
Electronics Forum | Wed Apr 11 00:17:03 EDT 2001 | Dreamsniper
Hi, We got a 0.5mm pitch QFP144 from Altera with the below lead width specs. min. lead width = 0.17mm nominal = 0.22mm maximum = 0.27 What's the best pad or land width for the above? This is what our designer used. Land Width = Component Lead Wi
Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr
Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while
Electronics Forum | Thu Apr 03 09:08:50 EST 2003 | rdr
Thanks Scott,Iman, The problem has been isolated to detachment from package so I believe that there are no fabrication issues related to the Gold on the PCB. What is a Moyet analisys? where can I find more info? Dave, I am still waiting on Altera t
Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie
Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).
Electronics Forum | Tue Dec 07 10:47:09 EST 2010 | walkbury
As a high mix, low volume CEM who deal with a lot of free-issued kits, we are heavily reliant on foil (tape cover) extenders. We don't usually bother with splicing as our machine feeders (Simenes Siplace and Samsung SM321) are designed in such a way
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