Electronics Forum | Mon Aug 11 10:37:19 EDT 2008 | realchunks
I assume you mean the balls of the BGA, not pads (laugh it up guys - I said balls). If so, you may have a no-lead BGA or a high temp BGA.
Electronics Forum | Mon Aug 11 11:00:40 EDT 2008 | eyalg
RoHS BGA. No lead in it. > RoHS BGA. No lead in it. ok. this is not the case .It was sn/pb type...
Electronics Forum | Mon Aug 11 13:55:09 EDT 2008 | guhansub1
Your defect may be possibly due to black pads, although it is rare on component side. Is your BGA pad finish ENIG? If so, inspection using a SEM can give clues on the presence of black pads
Electronics Forum | Mon Aug 11 14:04:51 EDT 2008 | realchunks
Then your profile is way off. You need a t-couple mounted under the BGA on one of the center balls to measure correctly.
Electronics Forum | Mon Apr 13 16:02:17 EDT 2009 | abdelga
Anyone with any thoughts (pro or con) for the following options for Quad, QSV-1 pick and place?: detachable feeder bases IQ system
Electronics Forum | Tue Jun 22 08:37:52 EDT 2010 | davef
Dennis: These "terminal detach failures" probably are caused by thermal shocking of the components. * Preheat the components * Use a hot air pencil rather than a soldering iron
Electronics Forum | Thu Aug 18 05:07:53 EDT 2011 | johndoe0222
I received an error on my fuji ip3 which is: "Placing head 1 nozzle has become detached." Does anyone have any idea what is going on and how to fix this. Thanks
Electronics Forum | Sun Jun 12 09:29:41 EDT 2016 | davef
I'd guess that the interconnect pads on the BGA have poor solderability. Confirm this with testing at an independent lab. Work with your supplier to resolve the issue.
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Mon Aug 11 10:45:04 EDT 2008 | eyalg
I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA. hi I mean that the the balls were left on the board and the BGA pads were found clean. What do you
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