Electronics Forum | Mon Aug 11 10:47:40 EDT 2008 | dphilbrick
Sounds like bad BGA's to me. I suspect this is rare but you can get black pad on the BGA attach pads just like you get them on a PCB. Do you have un-processed BGA's?(still in package) I would have one tested (not by the manufacturer)!
Electronics Forum | Tue Aug 25 06:11:13 EDT 2009 | ghepo
Eric, use the TM 650 test method annexed. Don't forget to perform many test on many PCB (TOP and BOTTOM)on PADs in several position (at 4 corners and at the center) and obviously in the faulty position. Don't forget to change every time the tape. V
Electronics Forum | Mon May 16 06:02:14 EDT 2011 | bobpan
Multiple times i have seen where the downward camera lens inside of the camera becomes detached inside. It is just glued down. To see if this is the problem. Park the head over a spot and tap on the camera every direction. The crosshairs should NOT m
Electronics Forum | Fri May 23 15:33:39 EDT 2014 | hegemon
I don't see any visuals that make me think of black pad phenomena. I do note that it appears that pads on the BGA itself have detached and been left on top of some of the solder balls. To me it looks like the temperature profile is not correct, not
Electronics Forum | Wed Jun 14 01:52:57 EDT 2017 | bukas
I have been using IPA for more than 3 years with no damage to stencils. what some cleaning solvent manufacturers claim is that you get better separation with their products, some even recommend nitrating stencil to enhance separation and avoid paste
Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park
Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?
Electronics Forum | Thu Jul 22 22:57:14 EDT 1999 | Earl Moon
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Mon Jul 26 15:09:31 EDT 1999 | APE South
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Wed Oct 08 23:49:29 EDT 2003 | cngodles
I need to wire some LED's. I have a pair installed in my headlights that use some sort of small thing at the end of the wire. They run off of the 12 volt car battery. They can stay on for over a month without starting the car and still not drain the
Electronics Forum | Fri Sep 04 13:49:30 EDT 2009 | xps
Hi, in our company, we had performed a failure analysis on some PCB finishing ENIG faulty, cause detachement of heavy components. So we performed a SEM / EDX analysis on the nickel and we discover a 20 % of carbon instead of the standard 0.04% (on s
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