Electronics Forum | Tue Jun 22 08:37:52 EDT 2010 | davef
Dennis: These "terminal detach failures" probably are caused by thermal shocking of the components. * Preheat the components * Use a hot air pencil rather than a soldering iron
Electronics Forum | Thu Aug 18 05:07:53 EDT 2011 | johndoe0222
I received an error on my fuji ip3 which is: "Placing head 1 nozzle has become detached." Does anyone have any idea what is going on and how to fix this. Thanks
Electronics Forum | Sun Jun 12 09:29:41 EDT 2016 | davef
I'd guess that the interconnect pads on the BGA have poor solderability. Confirm this with testing at an independent lab. Work with your supplier to resolve the issue.
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Mon Aug 11 10:45:04 EDT 2008 | eyalg
I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA. hi I mean that the the balls were left on the board and the BGA pads were found clean. What do you
Electronics Forum | Mon Aug 11 10:47:40 EDT 2008 | dphilbrick
Sounds like bad BGA's to me. I suspect this is rare but you can get black pad on the BGA attach pads just like you get them on a PCB. Do you have un-processed BGA's?(still in package) I would have one tested (not by the manufacturer)!
Electronics Forum | Tue Aug 25 06:11:13 EDT 2009 | ghepo
Eric, use the TM 650 test method annexed. Don't forget to perform many test on many PCB (TOP and BOTTOM)on PADs in several position (at 4 corners and at the center) and obviously in the faulty position. Don't forget to change every time the tape. V
Electronics Forum | Mon May 16 06:02:14 EDT 2011 | bobpan
Multiple times i have seen where the downward camera lens inside of the camera becomes detached inside. It is just glued down. To see if this is the problem. Park the head over a spot and tap on the camera every direction. The crosshairs should NOT m
Electronics Forum | Fri May 23 15:33:39 EDT 2014 | hegemon
I don't see any visuals that make me think of black pad phenomena. I do note that it appears that pads on the BGA itself have detached and been left on top of some of the solder balls. To me it looks like the temperature profile is not correct, not
Electronics Forum | Wed Jun 14 01:52:57 EDT 2017 | bukas
I have been using IPA for more than 3 years with no damage to stencils. what some cleaning solvent manufacturers claim is that you get better separation with their products, some even recommend nitrating stencil to enhance separation and avoid paste
