Electronics Forum | Thu Jun 04 12:26:30 EDT 1998 | Dave F
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
Electronics Forum | Thu Feb 14 20:24:07 EST 2002 | scott
My first reaction would be to run! FAST! Flex -- well, it... flexes... and isn't flat. While you assemble it, While you transport it, While it goes through the oven... SMT Connectors typically need to be held down during reflow. Fiducial types are
Electronics Forum | Mon Dec 20 07:59:04 EST 1999 | Wolfgang Busko
Hi Mike, many questions and there is no simple answer. How did you manufacture your add-on-boards ? Do you think you can handle the processes that go along with assembling SMT- and THT-Boards ? Before you start determine what you gonna do: - How man
Electronics Forum | Wed Nov 18 10:39:48 EST 1998 | Scott Lolmaugh
| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | | | Chris, | | It may be helpful if you could translate DPM into a meaningful phrase as many people (my
Electronics Forum | Thu Mar 29 15:26:35 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Mon Apr 01 10:09:03 EDT 2013 | markhoch
It sounds as if you have your AOI set up off-line, and you're "AOIing" a sampling of the PCBs produced. If that’s the case, then the responsibility of who drives the inspection really depends on how you configure it. If it's based on the number of P
Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW
| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any
Electronics Forum | Tue Nov 16 10:53:25 EST 1999 | Scott Cook
Ok, help me out here guys and gals...... I have never understood the concept of scoring on mixed technology or SMT boards. It is quite obvious to me that the potential for SMT solder joint damage through the mechanical stresses of breakout are high.
Electronics Forum | Fri May 08 18:39:17 EDT 1998 | Steve Gregory
| | As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? | | Any advice is appreciated. | | Greg Hi there Greg! First, I just gotta
Electronics Forum | Wed Jan 06 10:25:15 EST 2016 | swag
I've done more if this that you can possibly imagine. I've designed 100 or more router fixture plates. It's not always easy that's for sure. We use a Cencorp router. It does O.K. but definately a little tricky to get nice cuts in the flex only ar
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