Industry News | 2003-02-13 08:16:35.0
SMT China Will be the First Magazine in China Focused Specifically on the Major Technologies and Products Used in PCB Assembly
Industry News | 2016-11-14 20:04:34.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that SMT Hautes Technologies, has selected MIRTEC’s award winning MV-7 OMNI as their future 3D AOI platform of choice.
Industry News | 2003-04-04 08:46:37.0
Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Industry News | 2021-10-11 16:13:11.0
MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.
Industry News | 2023-08-29 07:36:15.0
"DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" provides overall solutions for SMT equipment and 3C intelligent factories.
Parts & Supplies | Chipshooters / Chip Mounters
Product size (mm): L350*W260*H235 G.W: 12KG Product material: stainless steel plate Samsung SM feeder feeding Loading Unit is made of high-quality steel baking paint, which is used for feeder offline loading, and can hold 10 feeder at the same t
Parts & Supplies | Pick and Place/Feeders
Samsung SM feeder feeding Loading Unit is made of high-quality steel baking paint, which is used for feeder offline loading, and can hold 10 feeder at the same time SM421 MVME3100 board MVME3100_SM4XX J91741034A_AS; 2. SM431 MVME3100 board MVME3
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
