Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Fri Nov 08 17:49:05 EST 2013 | davef
First, it's a surprise that your failure analysis lab thought everything was OK with these boards. They look like shit. Second, a few years ago, there was a bunch of complaints about ENIG boards with issues similar to what you're observing. There wa
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephani Gulbrandsen, Julie Silk, Alex Chiu, and Yew-Hoong Chan Abstract 26-4 Is a High Phosphorus Content in the Nickel Layer A Root Cause for Black Pad on ENIG Finishes? Dipl.-Ing. Mustafa Özkök, Joe
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
soldering Reflow soldered joint Reflow reballing Reflow profile for sac305 Reflow pcb oven Reflow oven soldering Reflow oven profile Reflow oven pcb Reflow medical Reflow led Reflow joints Reflow gpu
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