New Equipment | Assembly Services
The board is designed by customer and it's for Power Bank PCBA board. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 2 Layer PCBA board Material: FR-4 Thicknss: 1.6mm Surface:
New Equipment | Assembly Services
The board is designed by customer and it's for Network interface controller. We did one-stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly). Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1
New Equipment | Assembly Services
The board is designed by customer and we did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1.6mm Surface: HASL Solder mask: Green
Zoomtak Electronics is an electronics manufacturer for printed circuit boards for years. We offer PCB production service for a variety of PCB types and quantities: Single-sided, double-sided, and multi-layer boards CEM-1, FR-4, FR-4 TG170, Aluminum
1) 120*130mm/1up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting ho
1). 1+C+1 HDI, blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability
Layers count: 4, Flex layers count: 2, Surface treatment: Immersion gold, Minimum hole size: 0.35mm, Minimum line width/space: 8/5.9 miles, Thickness: Rigid board: 2.00mm, Flex board: 0.24mm Size: 397.89 x 555mm
High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:
New Equipment | Fabrication Services
Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger Solder mask color: green Size: 125.09 x 95.25/1up SMT SMD, 230 DIP and 4 pieces component