Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold
Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold
1) Single Sided PCB 2) Material ranges: FR-1, 94VO/HB, 22nf, CEM-1 and CEM-3, FR-4 3) Copper weight: 1-2 oz 4) Profile: Punch 5) Thickness: 0.8mm-1.6mm 6) Surface finish: OSP, HASL, Immersion Gold
1. Bergquist metal backed 2. 1.6mm thick, single sided, 1oz 3. Black solder mask 4. CNC rout outline 5. immersion gold 6. Applications: LED prodcuts, High power supply, Computers etc
1. Thermagon metal backed 2. 1.6mm thick, single sided, 1 oz 3. Black solder mask 4. CNC rout outline 5. immersion gold 6. Applications: High power supply, Computers, Industrial power equipment, LED
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 10layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold
Materials: FR-4 Copper Thickness: 2 oz Layer Count: 8 Layer, 2.4 mm Min. Hole Size: 16 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold
Materials: FR-5 Copper Thickness: 1 oz Layer Count: 8 layer, 1.6 mm Min. Hole Size: 4 mil Min.Line Width/Space: 3 mil Finishing: Immersion Gold
Materials: FR-4 Copper Thickness: 3 oz Layer Count: 6 Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 6 mil Finishing : Immersion Gold
