Full Site - : dewetting immersion gold (Page 10 of 60)

GK-4

GK-4

New Equipment | Materials

Materials: FR-4 Copper Thickness: 3 oz Layer Count: 6 Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 6 mil Finishing : Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

QC-1

QC-1

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold + Carbon ink

Zhuhai Camtech Circuit Co., Ltd

Rogers 4350 PCB

Rogers 4350 PCB

New Equipment | Other

Rogers 4350 PCB/Ceramic PCB Layer count: Single-sided PCB Board thickness: 0.8mm Copper thickness: 1oz Dielectric Constant(DK): 3.48 Surface treatment: Immersion Gold

A-Tech Circuits Co.,Limited

8 layers PCB with BGA and golden fingers

8 layers PCB with BGA and golden fingers

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers

CYZON LIMITED

8 layers PCB with blind buried vias

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED

printed circuit board prototype produce

printed circuit board prototype produce

New Equipment | Assembly Services

HDI Board Number of Layers 10 layers Thickness 1.0mm Surface Treatment Immersion Gold Min line width, line spacing 3/3mil HD

Hunan Speeda Technology Co Ltd

printed circuit board prototype produce

printed circuit board prototype produce

New Equipment | Assembly Services

HDI Board Number of Layers 10 layers Thickness 1.0mm Surface Treatment Immersion Gold Min line width, line spacing 3/3mil HD

Hunan Speeda Technology Co Ltd

Study of Various PCBA Surface Finishes

Technical Library | 2015-11-25 14:15:12.0

In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.

Flex (Flextronics International)

Your Guide to Process Defect of the Month

Industry News | 2016-08-19 05:00:52.0

If you have a process problem, let NPL Defect of the Month Video help you team

ASKbobwillis.com

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

New Equipment | Fabrication Services

RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban

Advanced Circuitry International


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