Electronics Forum | Tue Apr 17 10:16:42 EDT 2001 | davef
Welcome to SMTnet. Awww, those assemblers are always whining about something. Just tell him to shut-up and build the blankin� boards. Jeesh!!! We used to have copious archives on the topic on SMTnet and our friend Brian is working his fingers t
Electronics Forum | Thu Jun 14 04:24:32 EDT 2012 | brettrenishaw
Yes pads are still gold after the wave soldering process even if you wave solder a pcb several times. I have tried soldering using an iron and the solder takes to the pad as you would expect. This happens on all boards of this type and all boards are
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Thu Feb 15 07:47:12 EST 2007 | zanolli
1" long SMT components to be placed without coplanarity issues> Also, what types of finishes are common for the flex;i.e, ENIG, immersion Ag, etc.?
Electronics Forum | Thu Dec 08 08:18:29 EST 2005 | grantp
Hi, We have recently moved to flash gold as well, as we had solderability issues with emerson gold, and this was supposed to be a solution. However I did not know flash gold would be thicker, and could have other issues. Is flash gold a stable boar
Electronics Forum | Thu Dec 08 08:29:25 EST 2005 | davef
Grant The solution to soldering problems with immersion gold boards is: find a supplier that can control his/her process. Electroplated gold over nickel is a very reasonable process. Billions of wire bound boards use it evry year.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
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