Electronics Forum | Thu Dec 08 08:29:25 EST 2005 | davef
Grant The solution to soldering problems with immersion gold boards is: find a supplier that can control his/her process. Electroplated gold over nickel is a very reasonable process. Billions of wire bound boards use it evry year.
Electronics Forum | Thu Dec 08 01:05:34 EST 2005 | Mike_Kennedy
Our new PCB supplier can give us a 20% price reduction if we convert from an ENIG finish to a FLASH gold finish. My uderstanding between the two is as follows: ENIG - Nickel is plated over copper and then immersed in Gold which forms a self limited f
Electronics Forum | Wed Dec 14 07:34:33 EST 2005 | davef
Mike Ozzy If I came to your house, I wouldn't punch you. I'd make you buy me beer. Vern Solberg; Tessera Technologies Inc., 3099 Orchard Dr, San Jose, CA 95134; 408 568 3734 F408 894 0768 vsolberg at tessera dot com. If that doesn't work try: Tes
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon
| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered
Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F
Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft
Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F
Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft
Electronics Forum | Thu Nov 19 13:49:00 EST 2009 | bricke
We have been manufacturing a part using bright electrolytic tin as the finish. Our customer has been hand soldering using 63/37. They have recently switched to SN96 and have been experiencing solderability issues. We have sent samples to an outside
Electronics Forum | Sun Feb 05 09:49:11 EST 2006 | Cmiller
We have been using ENIG for 8 years as our primary board finish. We have not seen any issues with tenting the vias. We have used a number of suppliers. The ENIG from China does not seem to solder quite as well in general but only had black pad from o
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